Beijing (Gasgoo)- On August 20, SAIC Motor and ZTE Corporation jointly hosted the global launch of their domestically produced vehicle communication module platform. Alongside this event, the two companies signed an agreement to deepen their strategic partnership.
Signing ceremony; photo credit: SAIC Motor
In response to the growing trend of domestic automotive chip production, SAIC Motor has achieved the volume production and application of the industry's first China-made automotive-grade dual-core 4G communication module. This module will debut in the MG7 B-segment coupe and gradually be applied across SAIC Motor's global vehicle lineup, significantly enhancing the intelligence and connectivity of the company’s vehicles.
As competition intensifies in the automotive market, intelligent connectivity has become a critical strategy for Chinese automakers to navigate market changes. SAIC Motor R&D Innovation Headquarters has introduced a key product development model, which emphasizes platform-based and standardized design to optimize products from the ground up. This model marks the first deep technical integration between vehicle, component systems, and chip suppliers, breaking industry barriers for collaborative development and continuously improving product quality and customer experience.
The vehicle communication module, a key product of this collaboration, is based on ZTE's fully self-developed automotive-grade communication module. The module incorporates ZTE's in-house developed platform, which has passed AEC-Q100 product certification and network certification in over 70 countries. Designed and manufactured according to IATF 16949 automotive quality management standards, this 4G module supports global 2G/3G/4G networks and offers high reliability, security, and low power consumption, taking a significant step forward in the marketization of domestic automotive communication chips.
After the product launch, SAIC Motort and ZTE inked a deepen cooperation agreement, which will expand from 4G to 5G communication modules, automotive operating system software, computing power development, and innovative technologies like large models. The partnership will also extend horizontally to areas such as digital transformation, corporate development strategy, R&D management, internationalization, and compliance management.
