Gasgoo Munich- Infineon Technologies and United Automotive Electronic Systems (UAES) officially inaugurated the Innovation Application Center (Chongqing) at UAES's Chongqing branch on September 16.
Image Source: Infineon
Notably, this year marks the tenth anniversary of the joint Innovation Application Center at the companies' Shanghai headquarters. The launch of the Chongqing facility is viewed by both parties as a new starting point for cross-domain collaboration.
Under the roadmap, the partners will integrate their semiconductor expertise and system design experience earlier in the product development process. By aligning with OEM needs at the initial project stage, they aim to produce mass-producible, high-reliability automotive electronics solutions more efficiently. The focus will also remain on strengthening supply chain resilience and developing next-generation electronic-electrical (E/E) architectures.
During a concurrent technical exchange, the two sides engaged in deep discussions on multiple frontiers of automotive electronics.
Specific topics included the roadmap for next-generation vehicle architectures, the localized promotion of related components, and the restructuring of the new AURIX™ TC4x MCU embedded control core. The agenda also featured optimizations for on-board charging platform design and full-stack power solutions for 48V vehicle architectures.
Furthermore, the companies exchanged views on innovative applications for digital platform expansion. These explorations are expected to provide new approaches for shortening verification cycles for motor control and domain control products, while improving the stability of project deliveries.
