Gasgoo Munich-GreaTech Substrates broke ground on an advanced packaging substrate project on September 29 at the Sino-Singapore Guangzhou Knowledge City, according to the "Guangzhou Huangpu Release" WeChat account. Once completed, the facility will expand GreaTech Substrates’s capacity for high-end packaging substrates and bolster the regional semiconductor supply chain.
Image Source: Guangzhou Huangpu Release (Li Jianfeng)
The first phase spans 312 mu, with a total floor area of approximately 360,000 square meters. Its focus is high-end Flip Chip Ball Grid Array (FCBGA) packaging substrates, which are essential for data centers, high-performance computing (HPC), and cloud computing. Production from the site is expected to significantly elevate GreaTech Substrates’s technical strength and scale in the high-end substrate arena.
Public records show GreaTech Substrates Packaging Substrate Co., Ltd. settled in Huangpu District in 2021, focusing on RF, FC-CSP, and FC-BGA substrates. It has since become a core supplier for several leading global packaging firms. This new project is viewed as a strategic move to scale up capacity for the AI computing era.
Huangpu District is now home to more than 150 integrated circuit firms, forming a complete ecosystem that covers chip design, wafer manufacturing, packaging and testing, equipment and components, and end-use applications. The district holds about one-tenth of the country’s PCB capacity. Between January and August 2026, the local semiconductor and integrated circuit sector generated over 31 billion CNY in output value—a 36.6% jump from the previous year. This year alone has seen the launch of five major industrial projects exceeding 10 billion CNY, including Semicron Phase 4 and Rongjie.
