Gasgoo Munich-Gasgoo has learned that the DF30 — China's first high-performance automotive-grade MCU chip, developed under the leadership of Dongfeng Motor — has completed verification on multiple vehicles. Having successfully passed winter calibration trials in Mohe at -43°C, the chip is now moving steadily toward mass production and deployment.
Image Source: Dongfeng Motor
Positioned as the core control unit for engine ECUs, the DF30 acts as the "commander" of a vehicle's powertrain. High-end chips of this caliber have long relied on imports, creating supply chain vulnerabilities. To break that dependence, Dongfeng Motor partnered with the Hubei Automotive-Grade Chip Industry Technology Innovation Consortium. Led by the company’s R&D headquarters, the team achieved a fully independent, closed-loop process — from defining requirements to final vehicle application.
Built on an open-source RISC-V multi-core architecture, the chip is manufactured using a domestic 40nm automotive-grade process and meets the industry’s highest ASIL-D functional safety standard. The development team has completed 295 tests spanning basic performance, extreme stress, and real-world scenarios. Compatible with domestic operating systems, the DF30 suits both internal combustion and new energy vehicles, with overall performance matching that of international peers.
During extreme cold trials, Dongfeng engineers calibrated the chip for engine cold starts, knock control, exhaust temperature management, and comprehensive OBD diagnostics at -43°C. Every metric hit the mark. The DF30 is currently undergoing validation in models such as the Dongfeng eπ 007, M-Hero M817, and Dongfeng Aeolus Haohan.
To date, the project has secured over 50 invention patents and integrated circuit layout designs, while leading the creation of eight industry and group standards. This effort has established a complete, self-reliant innovation chain spanning requirement definition, R&D design, manufacturing, packaging, and testing, all the way to vehicle deployment.
