Gasgoo Munich- ECARX Holdings, Inc. has signed a non-binding memorandum of understanding with Arm to explore and develop next-generation high-performance AI computing platforms for mobility and cross-industry applications, according to a post ECARX issued on Nov. 2 via its WeChat account.
Image source: ECARX
Key Takeaways
·The memorandum establishes a framework for ECARX and Arm to explore advanced-node computing solutions, including joint research and development and product definition.
·The planned solutions will target mobility platforms and cross-industry applications including physical AI.
·Joint engineering work will cover system architecture, performance optimization, software adaptation, functional safety, toolchains and cybersecurity validation.
·The initiative builds on the companies' existing collaboration through automotive semiconductor company SiEngine.
Partnership scope
The teams plan to develop customized technology solutions for China and other global markets, extending beyond mobility into AI devices and other cross-industry physical AI applications.
Arm will support ECARX in developing optimized computing solutions for complex physical AI workloads across mobility and other industries. The companies said the collaboration would seek to improve computing performance, energy efficiency and deployment at scale for customers worldwide.
Existing chip collaboration
SiEngine's 7nm automotive-grade smart cockpit SE1000 SoC is in mass production, with cumulative shipments exceeding one million units, according to the company.
SiEngine is also developing a next-generation 5nm automotive-grade AI chip integrating cockpit and driving functions.
