Gasgoo Munich- Jingwei HiRain and Sanechips Technology officially inked a strategic partnership agreement on February 2. Under the agreement, the two parties will align with the evolving demands of the intelligent automotive industry, focusing on frontier fields such as intelligent connectivity, autonomous driving, and smart cockpits. Together, they aim to drive collaborative innovation and co-develop integrated hardware and software solutions for intelligent vehicles.
Image Source:Jingwei HiRain
Meanwhile, the companies will explore the integration of AI and large model technologies within autonomous driving and smart cockpit systems. By developing relevant technical solutions, the partnership aims to accelerate the industry's shift toward greater intelligence.
As automotive electronic and electrical (E/E) architectures continue to evolve, high-performance central computing platforms and cross-domain integration functions are accelerating toward deployment. This shift places higher demands on functional diversity, iteration efficiency, cost control, and supply chain security for computing platforms.
In this collaboration, Jingwei HiRain will leverage its expertise in automotive electronics software and hardware development, system integration, and engineering mass production. Combined with Sanechips Technology' technical strengths in automotive-grade "connectivity + computing" high-performance SoC chips, the two aim to co-create domestic solutions. These solutions will cover scenarios including smart cockpits, autonomous driving, cockpit-driving fusion, central computing, and T-Box, balancing both safety and cost-effectiveness. Together, the companies plan to build an open ecosystem spanning from underlying chips, operating systems, and middleware to upper-layer applications, facilitating the implementation of innovations from chip to system.
Jingwei HiRain and Sanechips Technology have previously engaged in technical exchanges and project collaboration within the automotive electronics sector. The formalization of this strategic partnership marks a new phase in their relationship. Looking ahead, the companies will integrate their respective resources in software and algorithms, automotive high-performance SoC chips, domain controller products, and system integration. Their goal is to provide relevant products and services to global automotive clients and support the development of China's intelligent connected vehicle industry.
