Gasgoo Munich- Xiamen Sitan Semiconductor and Xiamen Changelight have officially inked a strategic partnership agreement, according to a May 7 report by Gasgoo. Leveraging the semiconductor and optoelectronics cluster in Xiamen Torch High-tech Zone, the two aim to coordinate key stages of the supply chain—spanning Micro-LED epitaxy, light-emitting chips, and CMOS drivers—to strengthen and fill gaps in the industry.
Image Source: Sitan Semiconductor
Sitan Semiconductor has long specialized in Micro-LED R&D and industrialization, building a robust product portfolio and deep technical expertise in critical areas like high-precision CMOS driver bonding, white light integration, and module packaging. In the automotive Micro-LED race, the company has moved early on Die to Die and Wafer to Wafer processes. By pairing these with active matrix (AM) driving and fully customized driver technology, Sitan Semiconductor aims to effectively cut costs for large-format automotive chips and modules while meeting core demands for high yield, reliability, and longevity.
By reinforcing strategic alignment with upstream epitaxy processes and combining its proprietary CMOS drivers with experience from targeted development projects for top global Tier 1 automakers, Sitan Semiconductor is poised to break the technical monopoly held by foreign players in the automotive market. The goal is to build a closed-loop domestic ecosystem for automotive displays, spanning core components to system integration. Sitan Semiconductor has already secured targeted development contracts and mass production orders for its automotive Micro-LED products from leading international Tier 1 suppliers.
As a leader in the semiconductor optoelectronics sector, Changelight boasts significant advantages in Micro-LED epitaxy wafers and light-emitting chips, backed by scalable manufacturing and industrialization capabilities. It provides strong support in critical processes such as epitaxial growth and Chip-on-Wafer (COW) technology. In the automotive Micro-LED space, sapphire-based epitaxy is particularly well-suited for the industry’s harsh environments—high temperatures, bumps, and vibrations—thanks to its high technological maturity and operational reliability.
Leveraging years of process expertise in high-quantum-efficiency sapphire substrate epitaxy, Changelight has established itself as a core upstream supplier for Adaptive Driving Beam (ADB) systems. The company has constructed an integrated, self-developed mass production system ranging from epitaxial growth to LED chips, completing its technical reserve for chip-level solutions in both automotive lighting and displays.
Automotive displays are widely regarded as one of the most promising high-volume applications for Micro-LED. However, automotive-grade applications impose extremely strict requirements on heat resistance, shock durability, reliability, yield, and cost. Given current technological maturity, production yields, and compatibility with automotive standards, the combination of Die to Die or Die to Wafer processes with sapphire epitaxy is currently the best fit for commercializing automotive Micro-LED. Both companies have established long-term strategic layouts in this field, with technical roadmaps that align closely with automotive standards. This partnership will leverage their complementary supply chain strengths to break down technical and capacity barriers, accelerating the mass production of automotive Micro-LED and helping domestic display technology make a breakthrough in the global market.
