Wolfspeed, Inc. and Geener Microelectronics ("GEENER") have signed a memorandum of understanding in Hangzhou to collaborate on silicon carbide power module solutions.
Key Takeaways
·GEENER plans to prioritize Wolfspeed's silicon carbide bare dies for its next-generation power module platform, with initial applications including traction inverters for new energy vehicles.
·Wolfspeed will use its 200 mm silicon carbide production line to develop bare dies designed to meet or exceed GEENER's performance and product requirements, while providing supply and commercial support.
·The companies plan to jointly pursue design wins for high-voltage electric-vehicle platforms from major Chinese automakers.
·The cooperation will initially focus on new energy vehicles, with planned expansion into AI data centers, industrial power supplies and energy storage.
Image source: GEENER
Partnership scope
GEENER will give priority to Wolfspeed's solutions when selecting components for its power module programs and will offer the company preference in related commercial and sourcing arrangements.
Yu Daihui, president of Wolfspeed Greater China, said GEENER's capabilities span power module design, packaging and reliability validation. He added that GEENER has supplied power module solutions to automakers and is expanding into applications such as AI data centers.
GEENER's CEO Pan Yunbin said the partnership combines Wolfspeed's silicon carbide chip technology and manufacturing capacity with GEENER's module design, packaging and validation capabilities. He said the companies intend to support higher-voltage, more efficient EV systems while developing products for applications including AI data centers.
