GWM’s subsidiary breaks ground for new semiconductor module packaging & testing project

Shanghai (Gasgoo)- On Feb. 26, 2023, Wuxi Xindong Semiconductor Technology Co., Ltd., (“Xinding Semiconductor”), a subsidiary of Great Wall Motor (“GWM”), held a groundbreaking ceremony for its “third-generation semiconductor module packaging and testing” project, according a post on GWM's WeChat account.

The latest move marks a crucial step for Xindong Semiconductor towards the industrialization of the aforesaid project, said GWM.

Photo credit: GWM

As the core components of new energy vehicles, power devices account for about 30%-50% of the value of electric motor controllers. In the future, the cost, performance, and even the supply capability of power devices will serve as vital factors for automakers to stand out in the market.

As a member of GWM’s Forest Ecosystem, Xindong Semiconductor will complete the power semiconductor industry chain, provide core technologies and product support for GWM’s new energy vehicle business, guarantee supply security, and grasp the cost control ability of electrification-related core value chain, the automaker added. The layout of power semiconductors and the vertical integration of the industrial chain will be a major advantage GWM boasts in the NEV field.

Looking to the future, Xindong Semiconductor aims to develop third-generation power semiconductor SiC modules and application solutions, achieve the replacement with domestically built components through in-house R&D, efficiently integrate upstream and downstream resources, as well as realize independent control of the power semiconductor industry chain.

On October 21 last year, GWM announced that it planned to use its own funds with Wei Jianjun (chairman of GWM) and Wensheng Technology (Tianjin) Co., Ltd. to jointly establish Xindong Semiconductor, with a registered capital of 50 million yuan ($7.177 million). Incorporated on Nov. 1, 2022, Xindong Semiconductor features a business scope that includes the manufacturing and sales of power electronic components, IC chips, and discrete semiconductor devices, according to the corporate database Tianyancha.