U Power to adopt Renesas’ chips for building of UP Super Chassis

Shanghai (Gasgoo)- At the UP DAY 2023, a significant tech event held on March 7, U Power, a Chinese skateboard chassis developer, announced its cooperation with the world’s leading semiconductor chip supplier Renesas Electronics (“Renesas”).

Through the cooperation, U Power will use Renesas' R-Car V4H and R-Car S4 system-level chips to develop its UP HPVC (super computing platform) and UP Hub (super hub), two crucial modules to the UP Super Chassis.

It is noteworthy that the UP Super Chassis is China’s first skateboard chassis-by-wire ready for mass production launched at the said event at the same time.

Photo credit: U Power

As the industry's first open automotive supercomputing platform with flexible computing power, the UP HPVC has plug-and-play and cascade connection capabilities. The chips it carries can be flexibly increased or decreased in type and quantity, achieving high scalability of computing power to meet the different levels of autonomous driving needs from L2 to L4 and even above.

The UP Hub is capable of two major functions: regional control and gateway. Built on Renesas’ chips, it supports scalable ECU design. In addition to computing power, the UP Hub also has industry-leading communication capability. It has rich in-vehicle communications interface resource, covering current mainstream types.

Besides, the two parties will also work together to promote the UP HPVC and UP Hub products through comprehensive marketing plans.