Anhui-based chip company Top Electronics closes Pre-A funding round

Shanghai (Gasgoo)- On June 7, Anhui Top Electronics Technology Co., Ltd. (“TOPE”), a Chinese chip developer based in Anhui province, announced the completion of a Pre-A funding round that raised nearly 100 million yuan.

The funding from the fresh round is set to be primarily allocated towards building a production line for automotive-grade silicon carbide power modules, accelerating product development, enhancing production capacity, and reinforcing supply chain security.

TOPES' SiC power modules; photo credit: TOPE

Founded in October 2020, TOPE is a Chinese professional provider of third-generation semiconductor power devices and application solutions. Its portfolio includes SiC SBD, SiC MOSFET, SiC power modules, which are suitable for photovoltaic energy storage, high-end power supplies, new energy vehicles, charging piles, and other clean energy sectors.

The company stresses that its localized and well-controlled industry chain can meet the significant demand of vehicle manufacturers for silicon carbide devices.

In 2022, TOPE launched six 650V-1700V SiC MOSFETs with independent intellectual property rights. The company said its products exhibit smaller and more stable on-resistance and Miller capacitance over a wide temperature range. These devices possess excellent performance in the figure of merit and gate interference resistance, reaching leading levels both domestically and abroad. Moreover, its SiC MOSFETs have passed internal automotive verification testing and are slated for authoritative third-party automotive-grade verification in early 2023.

Furthermore, in 2023, the company plans to release 4-6 SiC MOSFET products, including power chips for the main drive applications of new energy vehicles, and third-generation SiC MOS products, aiming to further reduce chip size, optimize performance, and lower costs.

Ni Weijiang, the founder and CEO of TOPE, revealed that their automotive-grade silicon carbide module production line has been completed in Huzhou city, Zhejiang province, and is expected to go online by the end of 2023. The newly constructed module packaging line will closely align with the demand for new SiC MOSFET modules in new energy vehicles. The company has already reached a product cooperation intention with several complete vehicle manufacturers and Tier 1 suppliers, and will immediately conduct comprehensive vehicle testing and validation after mass production.