On Jan. 24, Chinese artificial intelligence solution developer AICT announced it had signed a "1+3" strategic cooperation agreement with the University of Hong Kong.
Jan. 26 , 2025
On January 24, automotive chip developer Black Sesame Technologies and automotive memory tech company Micron Technology jointly announced a collaboration to introduce a new advanced driver-assistance system (ADAS) solution.
Jan. 24 , 2025
At the recent Automotive World 2025 event in Tokyo, Chinese intelligent solution developer Neusoft signed a memorandum of understanding with ZENRIN Co., Ltd., the company announced on Jan. 23.
Jan. 24 , 2025
On January 21, LiDAR manufacturer Hesai Technology announced a production agreement with Chery Automobile for several upcoming vehicle models.
Jan. 22 , 2025
On January 21, Black Sesame Technologies and Dirac signed a memorandum of understanding to collaborate on high-quality automotive audio experiences using the former's C1200 family of chips.
Jan. 21 , 2025
AI perception and edge computing chip company Axera marked a new chapter in its five-year journey by establishing its autonomous driving headquarters in Chongqing's Liangjiang New Area.
Jan. 21 , 2025