Gasgoo Munich- During the 2026 Paris Motor Show, XPENG Chairman and CEO He Xiaopeng—the only Chinese auto executive invited to speak at the Paris Automotive Summit—unveiled the company's smart mobility solution business, "XPENG AI ENGINEERING." XPENG is now opening its smart vehicle technology to global partners, alongside a full-spectrum collaboration framework for its physical AI ecosystem.
Image source: XPENG
The smart vehicle framework spans full-vehicle platforms, modular technologies, and toolchains. The vehicle platform covers both structural and electrical/electronic (E/E) architectures, stretching from compact to large models to boost component reuse. Its E/E architecture runs on 10-Gigabit Ethernet, accelerating in-car data transmission by 33 times while supporting by-wire chassis and L3-targeted safety redundancies.
On the modular front, the package covers autonomous driving, an AI BOX, semiconductors, batteries, and e-motors. Highlights include Turing AI driving powered by a second-gen VLA large model, the Turing AI chip, an 8C ultra-fast charging battery, and 15-minute full-vehicle OTA updates. The AI BOX can run a 30-billion-parameter MoE model, while the 8C battery charges from 10% to 80% in just eight minutes. As for toolchains—spanning calibration, end-of-line testing, and AI diagnostics—they slash per-vehicle inspection time by 41 minutes and cut annual electrical-testing costs on the production line by 95%.
XPENG's physical AI ecosystem extends to humanoid robots, robotaxis, flying cars, the Turing AI chip, and foundational models for the physical world. The company's NGP has kicked off its first large-scale public test in Europe, with global customer rollouts planned from 2027. Mass production of its humanoid robot is slated for late 2026, with deliveries following in the first half of 2027. Flying cars have already secured over 7,000 orders. Meanwhile, the robotaxi unit—now branded "XPENGYOYO" (Xiaopeng Youyou in Chinese)—is in talks with multiple European mobility platforms.
