Gasgoo Munich - Axera Semiconductor officially listed on the Hong Kong Stock Exchange on February 10, marking the debut of the city's first edge computing AI chip firm.
The company offered 105 million shares at 28.2 Hong Kong dollars apiece, raising roughly 2.9 billion Hong Kong dollars, according to prior filings. Cornerstone investors included Will Semiconductor Hong Kong, XIN MA APPAREL INTERNATIONALl, JSC International Investment Fund SPC, and NGS Super.
Image Source: Axera Semiconductor
Founded in 2019, Axera Semiconductor specializes in high-performance AI inference chips for edge computing and end devices. Its competitive edge rests on two proprietary technology platforms: the "Aixin Tongyuan" mixed-precision neural processing unit (NPU) and the "Aixin Zhimou" AI-ISP (image signal processor). Together, these form a highly compatible, energy-efficient AI inference platform that supports mainstream architectures like Transformer and CNN. This allows for efficient AI inference on resource-constrained edge devices, significantly slashing deployment costs and latency.
Axera Semiconductor's product lineup targets three sectors: visual terminals, smart vehicles, and edge AI inference. Its visual system-on-chip (SoC) units are widely used in smart transportation and smart city infrastructure. Meanwhile, its automotive SoCs have moved into mass production for Level 2 to L2+ advanced driver-assistance systems (ADAS). The edge AI inference chips, on the other hand, power emerging distributed intelligence scenarios like smart manufacturing and smart homes.
According to CIC, Axera Semiconductor became the world's largest provider of mid-to-high-end visual on-device AI inference chips by shipment volume in 2024. It also ranks among the top three players in China's edge AI inference chip market.
As of September 30, 2025, cumulative SoC deliveries had surpassed 165 million units. Visual terminal SoCs made up the bulk at over 157 million. The 8850 series of edge AI inference chips—launched in 2023—saw shipments top 100,000 in 2024 alone. Meanwhile, smart vehicle SoC shipments exceeded 510,000 units, with the company securing designated projects from several leading automakers and Tier 1 suppliers.
