Black Sesame Technologies enters Midea's robotics supply chain

Edited by Betty From Gasgoo

Gasgoo Munich- Black Sesame Technologies has officially signed a framework agreement with Guangdong Meichuangxi Technology Co., Ltd., a wholly-owned subsidiary of Midea, according to a report by Gasgoo Embodied Intelligence.

Under the agreement, Black Sesame will leverage its established chip development, production capacity, and supply chain resources to provide domestic chips tailored to Meichuangxi's robotics and home appliance needs.

The partnership will initially focus on industrial and humanoid robots, working to adapt and validate chip solutions for real-world scenarios. The goal is to provide high-performance, reliable edge computing power for robotics, while simultaneously addressing chip demands for home appliances and accelerating the substitution of domestic semiconductors across multiple use cases.

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Image source: Black Sesame Technologies

Leveraging its experience in developing and mass-producing automotive-grade chips, Black Sesame is systematically expanding into the embodied intelligence arena. The company has launched its SesameX multi-dimensional embodied intelligence computing platform, featuring the Kalos, Aura, and Liora computing module series. These cover a computing range from 48 TOPS to nearly 600 TOPS, fully supporting the diverse processing needs of service, industrial, and humanoid robots.

Centered on the SesameX platform, Black Sesame has forged strategic partnerships in the robotics sector with dozens of industry leaders, including COSCO SHIPPING, Lenovo, and Joyson Electronics. Related solutions have already achieved commercial deployment in various complex environments.

As Midea Group's core platform for chip applications, Meichuangxi brings deep expertise in robot product development, smart appliance upgrades, and industrial implementation. With stable procurement needs and mature end-use scenarios, the subsidiary offers a vital channel for validating and scaling domestic chip applications.

Looking ahead, both parties will prioritize the deployment of chip solutions in the embodied intelligence sector while expanding their collaborative reach into home appliances.

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