BYD Semiconductor Ships Over 100 Million BMS AFE Chips

Edited by Yara From Gasgoo

Gasgoo Munich- BYD Semiconductor recently announced that cumulative shipments of its automotive-grade BMS (Battery Management System) Analog Front-End (AFE) chips have officially surpassed 100 million units. Since the debut of the BF8915A-1 in 2021—the first mass-produced, automotive-grade BMS AFE chip developed in China—the company has ranked first among Chinese manufacturers in both shipments and installations within this niche.

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Image Source: BYD Investor Relations

As a critical component of the BMS, the AFE chip converts analog signals—such as battery voltage, current, and temperature—into digital data. This allows the main control chip to execute state-of-charge estimation, health diagnostics, and charge-discharge management, meaning the AFE's accuracy and reliability directly dictate the BMS's overall performance.

According to BYD Semiconductor, these 100 million shipped chips have monitored over 1.6 billion battery cells without a single major quality incident in more than five years.

On the product front, BYD Semiconductor offers a complete chipset solution ranging from AFEs to multi-in-one ASICs. Core components—including MCUs, AFEs, auxiliary power chips, and daisy-chain bridge chips—are all self-developed and have achieved automotive-grade certification. The company also provides supporting tools such as GUI configuration software, evaluation boards, reference designs, and fault diagnosis libraries to help clients accelerate development.

Currently, its BMS AFE products are used by more than 20 pack manufacturers, OEMs, and energy storage integrators, powering hundreds of end-market vehicle models. Notably, the BF8915 series won the 2025 "China Chip" Award for Excellent Market Performance and the 2026 Automotive Electronics Golden Chip Award for Product Excellence.

Looking ahead, BYD Semiconductor said its next-generation AFE products will support higher cell counts—over 24 strings—and higher voltage ratings, with plans to add wireless communication options to boost reliability. Functional safety levels will span from ASIL-B to ASIL-D to suit various scenarios. Additionally, integrating Electrochemical Impedance Spectroscopy (EIS) detection is seen as a key direction, aimed at identifying cell aging and safety risks earlier.

BYD Semiconductor stated that as one of the few domestic firms with a complete BMS chip solution, it will continue to advance the technology of automotive-grade chips. The 100-million-unit shipment milestone is viewed as a stepping stone, not a finish line.

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