Gasgoo Munich-On June 12, United Nova Technology Co., Ltd (UNT) plans to build a joint venture in Shaoxing for a 12-inch mixed-signal chip production line with a monthly capacity of 50,000 wafers. Marked as the company's Phase 4 project, the venture calls for a total investment of about 20 billion yuan, with UNT contributing 3.012 billion yuan to secure a 25.1% stake.
Phase 4 is more than a simple capacity boost. It represents a systematic expansion by UNT into two high-growth arenas — AI server power and optical interconnect — while the company cements its dominance in new-energy vehicles and industrial control.
Image Credit: UNT
The project targets five key process platforms: a 55nm to 28nm automotive-grade MCU and AI edge DSP platform serving smart vehicles, industrial automation, and AIoT; a 90nm mixed-signal platform focused on high-performance BCD technology, which remains scarce domestically; a 55nm high-frequency power management platform for AI servers designed to deliver high power density to CPUs and GPUs; a 55nm silicon photonics platform for data center optical interconnect and AI cluster communication; and a 55nm SiGe transimpedance amplifier and laser driver platform. The latter works with the silicon photonics platform to offer a complete optical engine foundry solution.
With Phases 1 through 3 reaching full production, the start of Phase 4 will drive UNT's total wafer capacity above 400,000 wafers per month (8-inch equivalent). This move not only solidifies the company's dominance in domestic power and high-end analog chip manufacturing but also marks its deepening involvement in the global race for AI computing "chip infrastructure." For downstream automakers, Tier 1 suppliers, and data center equipment makers, UNT's capacity leap and technological expansion promise more diverse, high-reliability options for local chip manufacturing.
