- Chinese AI company AICT partners with HKU in smart city, transportation fields
On Jan. 24, Chinese artificial intelligence solution developer AICT announced it had signed a "1+3" strategic cooperation agreement with the University of Hong Kong.
Jan. 26 , 2025
- Black Sesame Technologies, Micron to co-launch new ADAS solutions
On January 24, automotive chip developer Black Sesame Technologies and automotive memory tech company Micron Technology jointly announced a collaboration to introduce a new advanced driver-assistance ...
Jan. 24 , 2025
- Neusoft joins hands with ZENRIN to help Chinese OEMs build navigation products for Japanese market
At the recent Automotive World 2025 event in Tokyo, Chinese intelligent solution developer Neusoft signed a memorandum of understanding with ZENRIN Co., Ltd., the company announced on Jan. 23.
Jan. 24 , 2025
- iMotion, Horizon Robotics form strategic cooperation in smart driving tech field
On January 21, autonomous driving company iMotion and smart computing solution provider Horizon Robotics officially signed an agreement to conduct in-depth strategic cooperation in automotive intellig...
Jan. 23 , 2025
- Dongfeng eπ partners with Huawei for smart NEV development
On January 22, Dongfeng Motor announced its new energy vehicle (NEV) brand eπ signed a strategic cooperation agreement with Huawei at Huawei's headquarters in Shenzhen.
Jan. 23 , 2025
- Hesai Technology secures LiDAR supply contract for several Dongfeng Motor's brands
LiDAR company Hesai Technology on Jan. 22 announced an exclusive mass-production agreement with Dongfeng Motor for multiple brands and vehicle models, including its premium new energy vehicle brand VO...
Jan. 22 , 2025
- Hesai Technology to supply ATX LiDAR for multiple Chery vehicle models
On January 21, LiDAR manufacturer Hesai Technology announced a production agreement with Chery Automobile for several upcoming vehicle models.
Jan. 22 , 2025
- Black Sesame Technologies, Dirac to co-promote automotive audio experience
On January 21, Black Sesame Technologies and Dirac signed a memorandum of understanding to collaborate on high-quality automotive audio experiences using the former's C1200 family of chips.
Jan. 21 , 2025
