Black Sesame Technologies allies with HKSTP to build R&D center in Hong Kong

Beijing (Gasgoo)- On November 6, Chinese automotive chip supplier Black Sesame Technologies joined hands with the Hong Kong Science & Technology Parks Corporation (HKSTP) to accelerate the establishment of Black Sesame Technologies' Hong Kong Technology Innovation and Research Center in the Science Park. 

Signing ceremony; photo credit: Black Sesame Technologies

This collaboration aims to drive the creation of an automotive-grade high-performance smart computing chip platform within the park.

According to the duo’s Memorandum of Understanding, Black Sesame plans to invest up to $100 million in R&D in Hong Kong by the end of 2027 and expand its local R&D team to 100 professionals. The HKSTP has been committed to advancing Hong Kong's new industrialization and developing a world-leading microelectronics ecosystem. The park currently hosts over 13,000 researchers and over 1,400 tech companies from 24 different countries and regions. The HKSTP will actively support Black Sesame Technologies in connecting with various resources and aid in its future listing plans in Hong Kong.

Over the years, Black Sesame Technologies has successfully launched various series of high-performance chips. The Huashan A1000 series chip is already in mass production and integrated into over ten car models. The recently launched Wudang C1200 series chip serves as a smart automotive cross-domain computing platform, providing a high-value and cost-effective solution.