On March 26, Chinese automaker JAC Group and Huawei Device Co., Ltd., signed a memorandum of understanding (MoU) to collaborate on the development of an intelligent information service platform.
Mar. 27 , 2024
Lei Jun, the CEO of Xiaomi, on March 26 announced on Weibo that Xiaomi is making significant investments in the field of intelligent driving, with its R&D team already surpassed 1,000 members, and is expected to exceed 1,500 by the end of the year.
Mar. 27 , 2024
On March 26, PATEO, a Chinese V2X tech company, signed credit agreements with seven banks, securing a total credit line of 19 billion yuan.
Mar. 26 , 2024
On March 20, the Hong Kong Special Administrative Region of China’s Office for Attracting Strategic Enterprises held the "OASES Partnership Signing Ceremony," welcoming a new batch of key enterprises to Hong Kong or expanding their operations.
Mar. 25 , 2024
On March 20, ECARX on its Tech Day 2024 brought forth the company’s latest advancements in intelligent cockpits, autonomous driving, automotive chips, and more.
Mar. 22 , 2024
On March 21, SemiDrive announced the release of its newest automotive-grade MCU products, the E3119F8/E3118F4.
Mar. 22 , 2024