On March 20, the Hong Kong Special Administrative Region of China’s Office for Attracting Strategic Enterprises held the "OASES Partnership Signing Ceremony," welcoming a new batch of key enterprises to Hong Kong or expanding their operations.
Mar. 25 , 2024
On March 20, ECARX on its Tech Day 2024 brought forth the company’s latest advancements in intelligent cockpits, autonomous driving, automotive chips, and more.
Mar. 22 , 2024
On March 21, SemiDrive announced the release of its newest automotive-grade MCU products, the E3119F8/E3118F4.
Mar. 22 , 2024
On March 19, 2024, autonomous driving solution provider WeRide announced a strategic collaboration with Lenovo Vehicle Computing to co-create an L4 autonomous driving solution.
Mar. 19 , 2024
On March 18, 2024, Seyond, a global provider of image-grade LiDAR solutions, announced its official collaboration with NVIDIA.
Mar. 19 , 2024
On March 17, DJI Automotive, the intelligent driving arm of DJI, revealed the latest updates to its intelligent driving platform, the "ChengXing Platform," at the China EV100 Forum 2024.
Mar. 18 , 2024