Gasgoo Munich- On February 24, Black Sesame Technologies said it has achieved a major milestone in cooperation with Automotive Intelligence and Control of China ("AICC"), after a joint intelligent driving solution built around the Huashan A2000 computing chip was selected for an intelligent driving program by a leading domestic automaker.
Image source: Black Sesame Technologies
The project marks the first publicly disclosed mass-production deployment of the Huashan A2000 since its launch, signaling the chip's transition from technical validation to commercial application in production vehicles.
According to the companies, the designated project will support full-scenario driver assistance functions ranging from L2+ to L3. Development will focus on three high-frequency use cases—highway navigation, urban navigation and automated parking. Black Sesame Technologies and AICC plan to carry out deep joint development, refining the system to handle complex driving conditions and ensure consistent performance and reliability across scenarios.
At the heart of the solution is the Huashan A2000, a 7-nanometer automotive-grade chip designed to support mainstream advanced driving algorithms such as BEV and Transformer-based models. The company says this computing capability provides the foundation needed for full-scenario, generalized driver-assistance functions.
The partnership reflects the complementary positioning of the two parties. Black Sesame Technologies brings experience in mass-producing and delivering automotive-grade intelligent driving chips, while AICC contributes its expertise in intelligent driving computing platforms. Together, they have integrated chip and software development into a unified solution. The first production vehicles equipped with the joint system are expected to roll off assembly lines in 2026.
Beyond the single project, the designation is widely seen as validation of the mass-production readiness of China's domestically developed advanced driver-assistance chips. It also offers a reference model for closer collaboration between chipmakers and software platform providers. As the solution enters production, it is expected to accelerate the broader rollout of L2+ and L3 intelligent driving features, supporting the industry's shift toward more advanced and widely accessible autonomy.
