Shanghai (Gasgoo)- On Jan. 13, semiconductor company GigaDevice Semiconductor (stock codes: 03986.HK; 603986.SH) officially debuted on the HKEX Main Board, completing its "A+H" dual-capital platform after its A-share listing in 2016. On the first trading day, the stock opened 45.06% higher at HK$235, valuing the company at HK$163.7 billion.
Image credit: GigaDevice Semiconductor
Founded in 2005, GigaDevice Semiconductor has remained focused on fabless chip design. Its product portfolio now spans Flash, specialty DRAM, MCUs, analog chips and sensor chips, with broad applications across consumer electronics, automotive, industrial control, energy storage equipment, IoT, PCs and servers, and communications. It is among the few Chinese companies that benchmark globally in several core memory and control chip segments.
In automotive-grade chips, the company has built a diversified lineup across memory and MCUs with applications at scale. Its automotive-grade Flash has shipped more than 300 million units to date, widely used in smart cockpits and driver-assistance systems. For high-compute MCUs, the GD32A7 automotive-grade series is in mass production and has secured design wins across multiple vehicle programs; cumulative shipments of the GD32A automotive-grade lineup have topped 8 million units. On Jan. 12, 2026, the company reached a strategic partnership with Chery Automobile, with both sides focusing on co-innovation in automotive-grade chips and next-generation electrical/electronic (E/E) architectures.
Image credit: GigaDevice Semiconductor
Notably, memory chips have entered a "super bull market" this year, with industry prices hitting record highs. DRAM prices are up 55%–60% month on month, creating new room for GigaDevice Semiconductor to expand its business.
The HKEX listing underscores GigaDevice Semiconductor's heightened strategic focus on international expansion. Looking ahead, the company said it will, with a global lens, continue to strengthen its diversified chip portfolio, seize structural opportunities in AI, IoT and smart vehicles, and build systemic competitiveness through technology innovation, ecosystem collaboration and brand-building.
