Gasgoo Munich- The Auto China 2026 opened today, April 24. At booth A109 in Hall A1 of the Capital International Exhibition Center, Rsemi zhiyuan (Hangzhou) Semiconductor Technology showcased its full lineup of R-LinC products and solutions. The company presented a comprehensive full-stack offering for high-speed data connectivity in intelligent driving and smart cockpits. A new 32Gbps automotive SerDes chip for cockpits was the highlight. It attracted significant attention and became a focal point for domestic high-speed connectivity chips at this year's show.
Image Source: Rsemi zhiyuan (Hangzhou) Semiconductor Technology
32Gbps Chip Leads as Cockpit Displays Enter Ultra-High-Speed Era
As smart cockpits evolve toward multi-screen, high-resolution, and high-refresh-rate setups, display links demand higher bandwidth and transmission quality. Mainstream mass-production solutions typically cap out at 6-12Gbps. They struggle to keep pace with cockpits requiring multi-screen 4K or even 8K displays. Some dual-channel solutions reach up to 24Gbps or 27Gbps. However, achieving 32Gbps usually requires signal compression. This trade-off can compromise user experience in high-fidelity scenarios.
Rsemi zhiyuan (Hangzhou) Semiconductor Technology's new 32Gbps automotive display SerDes chip addresses this industry challenge directly. With a 32Gbps transmission rate, it handles multiple uncompressed high-definition video signals simultaneously. This ensures ample bandwidth for instrument clusters, central control screens, passenger displays, and rear-seat monitors. The chip supports full-rate, lossless DisplayPort (DP) interfaces. Its serializer supports up to four 4K displays and can drive multiple screens using daisy-chaining. The deserializer integrates bridging and functional safety display capabilities. This effectively simplifies vehicle wiring harnesses and architecture while maintaining system reliability.
Compared to mainstream industry offerings, Rsemi zhiyuan (Hangzhou) Semiconductor Technology's 32Gbps chip represents a significant advancement. Without compressing image quality, a single chip now handles tasks that previously required multiple chips. For automakers, this means simpler system design, lower wiring costs, and reduced development complexity. This leaves room for cockpits to evolve toward even higher resolutions and more screens.
A dedicated gaming zone at the booth lets visitors experience this advancement. The ultra-high-speed transmission delivers fluid visuals and lag-free interaction. It provides a practical demonstration of the progress in cockpit display performance.
Rsemi zhiyuan (Hangzhou) Semiconductor Technology is developing even higher-bandwidth products, pushing beyond 32Gbps. From high-speed to ultra-high-speed, the company is building technical reserves to meet future data transmission demands in smart vehicles.
From Chip to Vehicle Integration: Rsemi zhiyuan (Hangzhou) Semiconductor Technology Reveals Mass-Production Milestones
At the show, Rsemi zhiyuan (Hangzhou) Semiconductor Technology presented a comprehensive matrix of R-LinC solutions for intelligent driving and cockpits. The solutions cover smart cockpit networking, cockpit-driving fusion, integrated driving and parking, and long-distance transmission.
In high-speed data transmission, long distances often lead to signal loss. This compromises data accuracy and stability. Rsemi zhiyuan (Hangzhou) Semiconductor Technology's high-speed SerDes chip features powerful high-insertion-loss compensation capabilities. It precisely identifies and dynamically compensates for signal loss in real time, counteracting attenuation. This ensures signals remain recognizable even after 40 meters of transmission. It eliminates the need for additional relay equipment, simplifies system architecture, and cuts costs and power consumption. Additionally, the chip features high-precision breakpoint detection. Using advanced algorithms and precision circuit design, it locates faults in complex transmission environments. This significantly reduces troubleshooting time and boosts system reliability and maintenance efficiency.
Rsemi zhiyuan (Hangzhou) Semiconductor Technology remains committed to reducing costs through technology. Its higher-integration chip designs help customers lower wiring expenses and development complexity without sacrificing performance or reliability. The core value of its solutions goes beyond chip performance and cost optimization. It lies in providing "turnkey, vehicle-ready solutions." From camera to display, R-LinC has established system-level capabilities covering high-speed data transmission across the entire vehicle.
Mass-market adoption is the strongest evidence of Rsemi zhiyuan (Hangzhou) Semiconductor Technology's capabilities. Founded in 2022, the company achieved its first mass-produced vehicle by July 2025. This spanned just four years from R&D to large-scale deployment. To date, Rsemi zhiyuan (Hangzhou) Semiconductor Technology's automotive-grade high-speed SerDes products have been integrated into nearly 40 models. These models are slated for mass production in 2026. This milestone confirms its capacity for large-scale volume production and stable delivery. It signals that domestic high-speed transmission chips are entering a new phase of rapid, widespread adoption.
Rsemi zhiyuan (Hangzhou) Semiconductor Technology's production milestones are on display at the booth. From actual vehicle demonstrations to interactive performance experiences and frontier AI edge computing, the company uses a multi-dimensional approach. It showcases its full-chain capabilities, from chip design to system integration. The AI edge application zone highlights use cases like streaming rearview mirrors and medical endoscopes. This further validates the potential of high-speed connectivity technology in broader fields.
Four years in the making, Rsemi zhiyuan (Hangzhou) Semiconductor Technology is making its move. Backed by solid production results and system-level solutions, the company is emerging as a key leader in automotive high-speed connectivity. From April 24 to May 3, at booth A109 in Hall A1 of the Capital International Exhibition Center, Rsemi zhiyuan (Hangzhou) Semiconductor Technology invites industry peers and partners to visit. They can experience the 32Gbps ultra-high-speed transmission and discuss the new landscape of smart vehicle connectivity.
