Gasgoo Munich- Gasgoo reported on April 11 at the Smart Electric Vehicle Development High-Level Forum (2026) that Black Sesame Technologies founder and CEO Shan Jizhang said VLA+ world models are migrating from the cloud to the edge. This shift will significantly enhance advanced autonomous driving capabilities, potentially surpassing human driving capabilities. The demand places high requirements on chip computing power; with advanced process capacity currently tight, structural semiconductor shortages require proactive planning.
Black Sesame's newly designed Huashan A2000 family has cleared US review and secured the chips. The series supports full-link floating-point computation, with the NPU achieving dual-link safety redundancy. It supports chip-to-chip interconnects to scale computing power to thousands of TOPS—ranging from 200 to 1,000 TOPS per chip—covering applications from city NOA to L4 autonomous driving. The chips also integrate a near-memory computing architecture, significantly reducing DDR bandwidth requirements and latency, while built-in 3D low-light enhancement supports extremely dark environments down to 0.001 Lux.
Shan revealed that Black Sesame listed in 2024 as China's first smart vehicle AI chip stock and aims to complete the country's first AI chip M&A deal in 2026. The company pioneered and mass-produced a cockpit-driving fusion solution in 2023. Business growth is projected to exceed 75% in 2025, while chip shipments in 2026 will exceed 10 million units. Moving forward, Black Sesame is leveraging its automotive mass-production experience to support embodied intelligence.
