Advanced SPAD dToF sensors supplier DaoSensing closes Pre-A++ funding

Beijing (Gasgoo)- Shanghai-based semiconductor design firm DaoSensing recently closed its Pre-A++ funding round, which raised for the company tens of millions of yuan.

Photo credit: DaoSensing

The fresh round was sponsored by THG Ventures Partners, TEDA Capital, and Panlin Capital. The substantial capital injection is earmarked for accelerating the development of new products and ramping up the mass production of DaoSensing’s existing offerings. Prior to this, DaoSensing had successfully concluded a Pre-A+ funding round with investment from Addor Capital.

Founded in 2021, DaoSensing specializes in the design of photonic sensors, with a particular focus on developing high-precision, low-power, and cost-effective SPAD dToF 3D sensing chips, notably for 3D sensors. The company has already introduced products like SPAD array chips, Spot dToF systems, and dToF distance sensors.

CEO and founder of the company, Li Qiang, a graduate of Tsinghua University's Department of Electronic Engineering, boasts multi-year experience in developing image sensor pixels and bringing imaging sensor products to market with leading domestic companies. The team, consisting of around 40 members, with 80% dedicated to R&D, is composed of experts from well-known Chinese image sensor companies and research institutions.

Li Qiang emphasized that the team's collective expertise, gained from prior roles in top-tier chip companies like Galaxycore, positions DaoSensing with robust R&D capabilities and efficiency in algorithms, optics, and module systems. This enables the company to swiftly iterate and upgrade products in response to market changes, providing efficient solutions optimized for clients.

Looking ahead, DaoSensing aims to extend its reach into the automotive LiDAR and AR/VR markets. Li Qiang revealed that SiPM and SPAD arrays tailored for automotive applications are already in the advanced stages of development.