On March 28, Chinese autonomous driving solution developer ZongMu Technology officially submitted its listing application to the Hong Kong Stock Exchange, intending to go public on the main board.
Apr. 3 , 2024
Chinese automotive chip developer SemiDrive and renowned global semiconductor manufacturer ROHM have jointly developed a reference design called "REF66004" for intelligent cockpits.
Mar. 29 , 2024
SiEngine, a Chinese provider of high-performance automotive-grade processor solutions, officially announced on March 28, that it successfully completed a Series B financing round worth hundreds of millions of yuan.
Mar. 28 , 2024
On March 26, Chinese automaker JAC Group and Huawei Device Co., Ltd., signed a memorandum of understanding (MoU) to collaborate on the development of an intelligent information service platform.
Mar. 27 , 2024
Lei Jun, the CEO of Xiaomi, on March 26 announced on Weibo that Xiaomi is making significant investments in the field of intelligent driving, with its R&D team already surpassed 1,000 members, and is expected to exceed 1,500 by the end of the year.
Mar. 27 , 2024
On March 26, PATEO, a Chinese V2X tech company, signed credit agreements with seven banks, securing a total credit line of 19 billion yuan.
Mar. 26 , 2024