Tencent spin-off TINNOVE joins hands with SemiDrive for smart cabin solutions

Beijing (Gasgoo)- Tencent’s spin-off company TINNOVE has teamed up with Nanjing SemiDrive Technology Ltd. to develop intelligent connectivity solutions in smart cabins.

TINNOVE and SemiDrive signning ceremony; photo credit: SemiDrive

With TINNOVE’s advanced technology and development experience in integrated solutions, the partners will implement SemiDrive’s intelligent cabin chip X9 series and TINNOVE’s OpenOS technical base into the fusion of system capability and chip power to test out the hardware potential of high computing power intelligent cabin chips.

TINNOVE was originally an IoV-based operating system business unit of China’s tech giant, Tencent, spun off in 2018. Relying on Tencent’s professional capabilities in AI, big data, cloud computing, the company renders OS solutions to the auto industry. Its OpenOS makes the cabin interactive system more flexible for businesses and can also drive the X9 SemiDrive chip to its maximum limits.  

SemiDrive’s X9 series are high-performance auto-grade chips aimed at advanced smart cabin solutions. The chips support cross-generation products with high compatibility and openness and can work well with the OpenOS.

The partnership between the two companies will help businesses shorten the adaptive period, cut R&D costs, and satisfy the personalization and customization demands of intelligent vehicle system software.