SAIC Motor-backed DIAS to co-build innovation center with ZTE

Beijing (Gasgoo)- On April 22, SAIC Motor and its automotive electronics subsidiary DIAS, deepened cooperation with Chinese communications solution developer ZTE. Meanwhile, DIAS and ZTE also established a joint innovation center and launched a T-BOX product solution. 

Photo credit: SAIC Motor

The jointly released T-BOX product solution designed and developed based on ZTE's automotive-grade 4G module. The 4G module has a built-in automotive-grade chip developed by ZTE that complies with AEC-Q100. The module is designed in accordance with the IATF16949:2016 standard, enables global network connectivity, has an exclusive network optimization and diagnostic solution, provides rich interfaces, supports information security, and meets the continuous cost reduction and efficiency requirements of automakers.

Leveraging the joint innovation center as the basic platform, ZTE and DIAS will carry out in-depth business and project cooperation in such areas as 4G/5G communication modules based on ZTE's self-developed automotive-grade chips, joint definition and development of T-BOX products, and supply chain exploration.

As the forerunner of SAIC Motor's automotive electronics R&D development, DIAS has  been deeply cultivating in two core business areas, intelligent chassis and intelligent driving/network connection technologies. The company’s products have achieved mass production.