ICV

Automotive Semiconductor Ecosystem Conference 2026

FAW's Jiang Shan: AI Calls for Automotive Software to Shift From Adaptation to Resource ManagementSep. 18 , 2026

Automotive Semiconductor Ecosystem Conference 2026

HIKSEMI's Chen Jian: Memory Bandwidth May Limit In-Car Computing; System Coordination Can HelpSep. 18 , 2026

4th AI-Defined Vehicle Forum

12-Month Vehicle Development Cycles Leave Suppliers Just 3–4 Months for ValidationSep. 18 , 2026

Automotive Semiconductor Ecosystem Conference 2026

Infineon's Liu Lin: All In on RISC-V as Next-Gen Automotive MCUs Shift to Open Architecture

Embodied Intelligence

Seeds | ENCOS Completes Over 300 Million Yuan Series B Financing

Embodied Intelligence

Gasgoo's Wang Xianbin: Overlap Between Automotive and Robotics Supply Chains Reaches 60%-70%

Humanoid Robot

Unitree's Xie Yipeng: Humanoid Robots to Enter Accelerated Development PhaseSep. 16 , 2026

Robotics

D-Robotics and GiGAAI Enter Strategic PartnershipSep. 16 , 2026

Embodied Intelligence

GIGAAI's Mao Jiming: World Models to Unlock Value via L1-L5 RoadmapSep. 16 , 2026

Chip

UNT and Jilin University Form Strategic Partnership to Jointly Develop Smart Chassis Chips

semiconductor

Geener Completes Shareholding System Restructuring

Hesai Technology

Hesai Technology, JD.com deepen cooperation on physical AI applications

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