Gasgoo Munich- Chinese automotive and industrial semiconductor developer SiEngine recently entered into a strategic partnership with SEER Robotics to jointly develop intelligent robotics solutions for industrial automation and embodied AI applications, according to a post on SiEngine's WeChat account.
Image source: SiEngine
Under the agreement, the two companies will build an integrated platform that combines automotive-grade computing power with industrial robot algorithms. The collaboration is aimed at delivering high-performance, highly reliable robotics systems that can be rapidly deployed across global markets.
As part of the cooperation, SiEngine will contribute a range of automotive-grade semiconductor technologies, including its "SE" smart cockpit chips, "AD" advanced driver assistance chips, "Tiangong" AI accelerator processors, and the newly launched the SE2000 integrated cockpit-driving AI chip.
These technologies will be paired with SEER Robotics' expertise in robotic brain control systems, mobile robots, embodied AI robot platforms, and software architectures. Together, the companies aim to create scalable embodied intelligence robots capable of operating in complex industrial environments while supporting continuous upgrades and large-scale global deployment.
The partnership will also extend to market expansion and supply chain optimization, with both companies leveraging their respective ecosystem resources to accelerate commercialization.
The agreement highlights SiEngine's broader strategic push beyond the intelligent vehicle sector and into what it describes as the next generation of edge-side intelligent computing platforms. By extending automotive-grade chip technologies characterized by high computing power, high bandwidth, and advanced safety capabilities into industrial robotics and embodied AI systems, the company is seeking to position itself at the center of a wider intelligent hardware ecosystem.
