Gasgoo Munich- According to "Invest Jiading," Union Semiconductor (Hefei) Co., Ltd. (Union Semiconductor, USC) held a signing ceremony on July 30 for its HITS advanced packaging R&D and industrialization project in Shanghai's Jiading District. The facility is now officially set to be based in Nanxiang Town.
The project involves a total investment expected to reach at least 7.5 billion yuan. It aims to build and operate an HITS advanced packaging process platform alongside an R&D headquarters. Focusing on five core technical bottlenecks, the initiative targets ultra-narrow pitch bump bonding, high-speed chip-to-memory interconnects, high-density interposer integration, large-size multi-chip packaging, and efficient thermal management. By solving engineering challenges from basic connectivity to high-speed data transfer and heat dissipation, the project seeks to solidify the packaging and interconnect foundation for high-performance computing chips.
Image source: Invest Jiading
Union Semiconductor's Chairman Zheng Ruijun stated that the team is already in place. The next phase involves recruiting more talent to bolster the technical force, ensuring solid progress in R&D and mass production to deliver self-controlled, high-quality products as quickly as possible. The initiative is expected to significantly boost Jiading's capacity for high-end advanced packaging and testing, strengthen collaborative innovation across the regional integrated circuit supply chain, and help attract top-tier talent.
In terms of industrial impact, the project will bridge critical gaps in the integrated circuit supply chain. By breaking through technical barriers and capacity constraints, it aims to drive the local packaging and testing sector toward high-end customization and high-value foundry services. Furthermore, the project supports the development of a self-controlled domestic IC ecosystem, reducing reliance on foreign advanced packaging and testing capabilities for high-end chips—essential support for strategic emerging industries like artificial intelligence.
As the northern core of Shanghai's "one body, two wings" integrated circuit layout, Jiading continues to see its industrial clustering effect grow. Data shows the district's IC industry scale is projected to reach 105.8 billion yuan in 2025, with output from designated-sized enterprises nearing 80 billion yuan. The district has already gathered over 700 IC-related firms, including 122 designated-sized enterprises, and established multiple key innovation centers, professional platforms, and core production lines. With ample space for development and a comprehensive supporting system, Jiading is intensifying efforts in industry cultivation and talent attraction while optimizing its business environment to ensure a solid foundation for high-quality projects.
