Black Sesame Technologies to provide A1000L chips for Hongqi's FEEA3.0 electronic architecture platform

Beijing (Gasgoo)- Black Sesame Technologies, a leading Chinese automotive chip supplier, announced on May 19 that it has been nominated as the supplier for FAW Group's Hongqi brand to provide intelligent driving chips for Hongqi’s next-generation FEEA3.0 electronic architecture platform. 

Photo credit: Black Sesame Technologies

Leveraging Black Sesame's A1000L series chips, Hongqi aims to develop a cost-effective and non-time-sharing integrated pilot & parking autonomous driving domain control platform, which will be applied to approximately 80% of Hongqi's entire vehicle model portfolio. Additionally, the collaboration between the two companies will lead to the mass production of Hongqi's E001 and E202 models, which are based on Black Sesame's A1000L chips, as early as 2024.

Black Sesame Technologies has already established comprehensive collaborations with FAW Group, FAW Intelligent Connected Vehicle Development Institute, and FAW (Nanjing) Technology Development Co., Ltd. in various aspects, including cutting-edge technology R&D, foundational platform construction, and mass production projects. 

The latest cooperation to assist Hongqi in creating an autonomous driving domain control platform further deepens the strategic partnership between the two companies.

Black Sesame’s A1000L chip delivers a computing power of 16TOPS in INT8 format and complies with multiple automotive standards, and has been mass produced. The Drive Sensing solution, built upon the A1000L chip, is the industry's only mass-producible single SoC solution for integrated pilot and parking functions. It supports L2+ driving assistance features like NOA, HPA/AVP parking, 3D 360-degree panoramic view, multi-channel DVR, and more, providing the industry with a high-value and cost-effective chip solution with exceptional performance and cost advantages.