Black Sesame Technologies brings several intelligent automotive computing solutions to IAA MOBILITY 2023

Beijing (Gasgoo)- Black Sesame Technologies, a Chinese automotive chip supplier, put on display its comprehensive lineup of intelligent automotive computing chips and complete solutions at the IAA MOBILITY 2023 held in Munich, Germany. 

Photo credit: Black Sesame Technologies

The company demonstrated its commitment to a global presence, striving to serve global enterprises with cutting-edge technology and product offerings.

At the IAA MOBILITY 2023, Black Sesame Technologies placed a strong focus on its Huashan series of high-computing power intelligent driving chips and Wudang series cross-domain computing chips. These products cover a wide range of L2-L3 BEV fusion algorithm applications, along with an autonomous driving solution and domain control platform based on the Huashan A1000 chip, co-developed with key customers such as Geely, Lotus, Desay SV, Baolong Automotive, and Joyson Electronics.

Photo credit: Black Sesame Technologies

In-house developed products, including the Huashan A1000/A1000L chips, the Wudang C1200 prototype, Huashan A1000 dual-chip FAD board, Huashan A1000+S32G autonomous driving domain controller, Huashan A1000L forward integrated controller, and Black Sesame Intelligent ADAS HIL data collection and data re-injection products are all on display at the event. These products were presented to industry experts and partners from around the world during the IAA MOBILITY 2023.

Solutions in collaboration with key ecosystem partners such as JICA Intelligent Robotics, Baidu, etc., were demonstrated in videos. These solutions include the NOA high-speed navigation system based on Black Sesame’s intelligent chips, ICA and PLC systems based on the Huashan A1000 chip, mass-produced BEV algorithm perception algorithms based on the Huashan A1000 chip, automatic parking, magic carpet functionality, and many others.