SiEngine, NEVC inaugurate joint lab for automotive SoC validation in Beijing

Beijing (Gasgoo)- On December 15, 2023, the National New Energy Vehicle Technology Innovation Center (NEVC) and ECARX-backed chip supplier SiEngine held a strategic cooperation signing ceremony in the Beijing Economic-Technological Development Area. Simultaneously, they inaugurated a joint laboratory aimed at the validation of automotive SoC.

Signing ceremony; photo credit: SiEngine

Leveraging NEVC's expertise in chip reliability evaluation, functional safety, and application assessment, alongside SiEngine's core technology in automotive-grade chip design and R&D, the duo aims to deepen cooperation in automotive SoC, intelligent connectivity, and automotive electronics. By pooling resources and capitalizing on respective strengths, they aim to facilitate the application implementation, industrial promotion, standard research, and ecosystem construction for domestically produced high-end automotive-grade chips.

Additionally, through the joint laboratory, the partners will delve into testing, validation across the chip lifecycle, operator tools, chain tools, and compilers, accelerating the application of top-tier automotive-grade chips in vehicle manufacturers and Tier 1 auto parts suppliers, aligning with international standards.

As the sole domestic manufacturer achieving mass production of 7nm automotive-grade chips, SiEngine has deployed the SE 1000 in multiple models including the Lynk & Co 08. This chipset, boasting cutting-edge architecture, delivers up to 100K DMIPS CPU power, 900 GFLOPS GPU power, and an 8 TOPS NPU power.