Gasgoo Awards 2023 applicant:Top Cool MOSFET from onsemi

Product: Top Cool MOSFET 

Description

onsemi's Top cool MOSFET simplifies design and reduces cost for compact power solutions, which assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. Housed in a TCPAK57 package measuring just 5mm x 7mm, the new Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime.The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1mΩ. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.TCPAK57 initial portfolio includes 40V, 60V and 80V. All devices are capable of operating at junction temperatures (Tj) of 175°C and are AEC-Q101 qualified and PPAP capable. This, along with their gull wings that allows inspection of solder joints and superior board level reliability, makes them ideally suited to demanding automotive applications.

Unique advantages

Conventionally, cooling discrete power devices such as MOSFETs involved passing thermal energy through the PCB to a heatsink. However, this is not an ideal thermal path and, consequently, device performance was hampered. Top cool MOSFET moves the thermal pad to the top, thereby allowing a heatsink to be bonded directly to the device. Not only does this improve cooling of the MOSFET, it also allows the underside of the PCB to be used for component placement, thereby increasing power density in critical applications such as automotive.

Application

high/medium power motor controls such as electric power steering and oil pumps.

Prospect

Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design. With more and more electronic components in the car, it also poses a challenge to heat dissipation, especially when many components in the car are operating at high power, so the automotive industry is constantly looking for ways to improve heat dissipation. For system designers, the higher the energy efficiency, the less waste heat is generated. In terms of thermal management, this means that fewer heat sinks or heat sinks can be completely removed, reducing the size, weight and cost of the solution. onsemi's Top Cool MOSFET provides excellent electrical efficiency and has eliminated the PCB from the thermal path, significantly simplifying the design while reducing size and cost.