Hesai Technology, Horizon Robotics agree cooperation on LiDAR solution development

Shanghai (Gasgoo)- Chinese LiDAR manufacturer Hesai Technology (Hesai) and AI chip developer Horizon Robotics formed a strategic partnership on August 5 to co-work on the development of factory-installed LiDAR solutions for highly automated cars, according to a post on Hesai's WeChat account.

Hesai, Horizon Robotics signing agreement; photo credit: Hesai

Under the agreement, both parties will develop LiDAR solutions leveraging Hesai's automotive-grade hybrid solid-state LiDAR AT128 and Horizon Robotics' Journey 5 chip, which is designed for full-scenario intelligent automotive applications.

Left: Hesai's AT 128 LiDAR, right: Horizon Robotics' Journey 5 chip; photo credit: Hesai

Through the collaboration, the two companies wish to offer more and better choices to their clients. By virtue of Horizon Robotics' intelligent automotive chips and Hesai's hybrid solid-state LiDAR, the built-in algorithm of the LiDAR solution they co-develop will help client handle the sensing point cloud information with greater efficiency.

Horizon Robotics, serving as a Chinese leading provider of edge AI chips, boasts the advanced capabilities in designing AI algorithm and chips. On July 29, the company launched the Journey 5 chip, its third-generation automotive-grade AI chip following the Journey 2 and the Journey 3. 

Used in smart vehicle computing platform, the Journey 5 is available for rapid volume production, the first of its kind in China. The company said it outperforms NVIDIA's Orin in terms of running points. Single chip of the Journey 5 boasts an AI powering power of up to 128 TOPS.

Dedicated to the R&D of laser sensing technologies, Hesai has accumulated a wealth of expertise in in-house-developed photoelectric chips, automotive-grade design process, automated production, functional safety performance, active anti-interference technology, and deep-learning-based perception capability. In early June, Hesai announced the completion of its Series D funding with over $300 million raised. The financing round was led by GL Ventures, Xiaomi, Meituan, and CITICPE.