Gasgoo Munich- The Auto China 2026 is to open its doors on April 24. Rsemi, a domestic leader in automotive-grade high-speed SerDes chips, is set to unveil its full R-LinC product portfolio. Through a mix of live hardware demos, technical deep dives, and scenario experiences, the firm will showcase its track record in intelligent driving. The highlight: a new 32Gbps in-cabin SerDes chip, positioning Rsemi as a provider of full-stack, high-speed connectivity solutions.
As smart cockpits race toward multi-screen, high-resolution, and high-refresh-rate setups, display links are under pressure to deliver more bandwidth and better quality. That puts the spotlight on Rsemi's 32Gbps automotive display SerDes chip. Capable of lossless transmission, it preserves every frame of the original image—eliminating the latency and artifacts caused by compression while fully unleashing bandwidth potential. The serializer supports up to four 4K screens, while the deserializer integrates bridging and functional safety features. This design not only boosts reliability but also streamlines vehicle wiring and architecture, driving down system costs.
This debut signals a milestone: domestic chips now boast 32Gbps ultra-high-speed transmission capabilities for cockpit displays, underpinning the high-definition, multi-screen, low-latency experience of the next generation. Visitors can test this firsthand at a dedicated gaming zone on the show floor, experiencing the immersive entertainment made possible by such high-speed data links.
Across both intelligent driving and cockpit domains, Rsemi will present its full R-LinC product matrix. The value proposition goes beyond raw chip performance to offer a "complete, production-ready solution." The R-LinC platform now delivers system-level capabilities for vehicle-wide high-speed data transmission, spanning from camera inputs to display outputs.
On the production front, Rsemi has secured design wins for nearly 40 models slated for mass production by the first quarter of 2026. This momentum signals that domestic high-speed transmission chips are accelerating into a new phase of large-scale vehicle adoption.
The booth will also feature an AI edge application zone, highlighting how Rsemi's high-speed SerDes technology extends into AI PCs and medical endoscopes. It's a showcase of the broad potential for high-speed transmission chips within the AI edge computing sector.
Moving from technical verification to mass production, and from individual chips to full-stack solutions, Rsemi has established itself as a pivotal force in the domestic high-speed SerDes market. From April 24 to May 3, the company invites industry peers and partners to Booth A109 in Hall A1 at the China International Exhibition Center (Shunyi Hall) in Beijing. Attendees can experience the 32Gbps visual capabilities firsthand and join discussions on the evolving landscape of intelligent driving and cockpit connectivity.
Image Source: Rsemi
