Gasgoo Awards 2022 attracts numerous candidates in automotive chip segment
Earlier this month, Gasgoo, a global leading automotive industry information service platform, has started the Gasgoo Awards 2022. For the Top 100 Players of China's New Automotive Supply Chain, the program will cover ten core segments, namely autonomous driving, smart cockpit, software, automotive chip, electrification, thermal management, body and chassis, interiors and exteriors, lightweight and new materials, as well as service providers.
In automotive chip segment, the Gasgoo Awards 2022 have attracted 26 companies with 28 technologies to apply for the Top 100 Players of China's New Automotive Supply Chain. Here are some details about them.
Product: Huashan Autonomous Driving Computing Chip A1000
Description
Huashan A1000 series chips have been in mass production. A1000 has acquired all vehicle regulation certifications. It is an autonomous driving chip with the largest computing power and the strongest performance. At the same time, it will also be the first mass-produced chip platform in China that conforms to vehicle specifications and supports the integrated domain controller of driving and parking with a single chip.
Photo credit: Black Sesame Technologies
Huashan A1000 autonomous driving computing chip is based on the two self-developed core IPs of Black Sesame Technologies - automotive-grade image processor NeuralIQ ISP and DynamAI NN automotive-grade low-power neural network acceleration engine, with a computing power of 58TOPS (INT8) - 116TOPS (INT4).
● Support L2 + / L3 autonomous driving
● Comply with ISO26262 and AEC-Q100 automotive regulation standards
● High performance ARM CortexA55Octa-Core @ 1.5GHz automotive-grade dual channel 32bit LPDDR4
● DynamAI NN engine with multi-dimensional heterogeneous architecture, with computing power up to 58 (INT8) - 116 (INT4) TOPS, and supports multi-sensor access such as camera, millimeter wave radar and lidar
● High performance NeuralIQ ISP technology supports real-time processing of 12 Channel HD and high dynamic images, with built-in five core high-performance computer vision (CV) acceleration engine and 4K video codec engine
Unique advantages
Based on the two self-developed core IP of Black Sesame Technologies - automotive-grade image processor NeuralIQ ISP and DynamaAI NN automotive-grade low-power neural network acceleration engine;
The first mass-produced high-performance autonomous driving chip based on mature vehicle regulation functional safety system in China, has passed the ISO26262 functional safety product ASIL-B ready certification, the functional safety process certification meeting the highest safety level ASIL-D in the automotive industry.
Application
Intelligent driving vehicles
Prospect
With the rapid development of intelligent EV industry, the autonomous driving function has gradually become the standard configuration of new listed models. And the automotive-grade chips with large computing power will become the basis for realizing the autonomous driving function. It is generally believed in the industry that 2022 will be the first year of mass production of L2++ level autonomous vehicle in China. Huashan A1000 chip is a mass-produced autonomous driving computing chip with the largest computing power and the strongest performance in China. With high computing efficiency and complete functional units, its comprehensive performance is in a leading position in the international market and meets various reliability requirements of automotive regulation certifications.
Product: KungFu Core 32- Bit Automotive MCU KF32A146
Despcription
Photo credit: ChipON
● KungFu32 Core
● Rich storage and peripheral resources
● 72Mhz main frequency
● 256KB ECC Flash
● 48KB ECC RAM
● 1*CAN-FD (compatible with CAN2.0)
● 1*CAN2.0
● 4*USART(LIN)
● 2*SPI(I2S)
● 2*IIC
● Grade 1 operating temperature range
● LQFP48/LQFP64
● 2.7~5.5V wide acting voltage
Unique advantages
KF32A146 is a 32-bit car gauge class MCU product tailored for the end node controller of the car, such as headlight control, seat, door, and window control, and air conditioning control, all of which can be easily driven. KF32A146 is positioned as a small package and small resources, integrating the CANFD interface, offering high-speed CANFD interface for vehicle end node controllers. The product enhances the cost performance of ECU in this application scenario. KF32A146 also supports FOC motor control and EPWM module, which is outstanding in motor control, and greatly broadens the application scope of Kungfu core MCU products in vehicle motor.
Application
BCM, Intelligent Cockpit, Instrument Control, Door Seat Control System, EPS, Window Controller, Seat Controller, Light Controller, Air Conditioning Controller
Prospect
The product helped establish a new domestic automotive-grade MCU technology peak, improved the cost-effectiveness of automotive end node controllers, broadened the application scope of domestic automotive-grade chip products in onboard motors, and accelerated the localization of automotive electronics.
Product: Automotive low-power, high-performance 16-bit ADC
Description
It is an auto-grade AEC-Q100 qualified battery pack monitor chip with advanced safety support for ASIL C chip. The chip focuses on high-precision measurement and low-power. XL8812 uses more optimized algorithms to make more accurate measurements and more advanced battery capacity equalization functions. XL8812 can measure up to 12 series of connected battery cells, while also supporting the series connection of multiple chips. The cell measurement range of 0V to 5V makes the XL8812 suitable for most battery chemistries. With an operating temperature range of -40℃～125℃, XL8812 has a wide application in new energy vehicles. XL8812 supports master-slave reversible bi-directional communication.
Photo credit: CHIPWAYS
Unique advantages
The low-power and high-performance ADC provides more accurate measurement for algorithms, with a total measurement error of 1.5mV, reaching the world's leading technology level. Its operating temperature range is -40℃～125℃, supporting the series connection of multiple chips, which is unique in China.
Application
This series of automotive battery monitor chips are used for measuring and balancing battery capacity, prolonging battery life, and protecting the battery. So, it has wide applications in new energy vehicles and electrochemical energy storage.
Prospect
With the promotion of energy conservation and emission reduction, the transition from traditional energy to renewable energy is also an inevitable trend. The storage and utilization of renewable energy are inseparable from power batteries. BMS AFE is an essential part of the battery management system, so the demand for battery pack monitors is bound to usher in explosive growth. According to the current market size of automotive and electrochemical energy storage and future growth trends, it is expected that around 2030, the annual demand for battery pack monitor chips will be hundreds of millions of pieces.
Product: High Resolution Solid-State LiDAR Sensing Chip
Description
It is a solid-state lidar based on the direct time-of-flight (dToF) technology, which measures the time difference from the light emission to the light reflection, calculating the object’s distance. dToF technology enables the ranging, imaging, and modeling of the three-dimensional natural environment. The working principle of dToF technology is simple, offering a long effective detection distance. The advantages of dToF also include high accuracy, low energy consumption, simple depth information calculation, and strong anti-interference ability.
Photo credit: Fortsense
Unique advantages
Fortsense is the world's leading SPAD sensor chip provider for LiDAR. Based on the substantial research and continuous R&D of lidar systems, Fortsense is becoming a critically important role in the new-generation auto industry. Fortsense focuses on developing SPAD devices with unique architectures, iteration, and the performance metrics such as PDE, DCR, Crosstalk, and Afterpulsing. Fortsense is capable to provide sensor chips based on 10-25um SPADs size types with BSI structure, and it is reaching a breakthrough for 7um development. The active matrix SPAD sensor chip integrates a randomly encoded transmit driver circuit and decoding algorithm, which greatly improves the reliability of LiDAR. The active matrix SPAD sensor chip supports the detection of up to five target objects surrounding as high as 100K Lux ambient light, unaffected by variable reflectivity. The high-resolution matrix sensor chip integrates data compression function to ensure lossless high-speed transmission of the original data.
● The photoelectric gain of SPAD is more than 10⁶, which is very sensitive and suitable for the detection of weak echo signals under long-distance ranging
● SPAD is compatible with the CMOS Fab process, with high yield and low cost
● SPAD detector can be arranged in different formats, e.g. single/integrated form, linear lines, or area arrays
● The working voltage of SPAD is generally 20-30V, which is adapted to various chips
● Digital output of SPAD can be processed through a comparator and TDC (time-to-digital converter), reducing the peripheral components and simplifying the system drastically
● High reliability and straightforward format of the product make the verification duration as short as 4~6 months.
Application
ADAS, autonomous driving, intelligent driving, C-V2X, low-speed vehicles, robots, AR/VR, etc.
Prospects
Since 2016, the scale of the global LiDAR industry has shown a rapid expansion trend year by year, and the growth rate has basically remained above 30%. It can be seen that in the future, LiDAR has a lot of room for improvement in consumer electronics, machine vision, unmanned driving, AR/VR, and other fields. LiDAR has become a key component of ADAS and navigation. LiDAR is widely used in the field of navigation, such as robots, drone obstacle avoidance, and intelligent vehicle driving.
1) Product: APM32F103RCT7
Description
Based on the Arm® Cortex®-M3 core, APM32F103RCT7 operates at 96MHz and features 256kB flash, 64kB SRAM, and a floating-point unit. Consisting of built-in USART, I2C, SPI, SDIO, I2S, USBD, CAN2.0B, and other rich peripheral resources, it supports simultaneous and independent USBD and CAN working modes, with up to 80 bi-directional I/Os.
Photo credit: Geehy
Unique advantages
APM32F103RCT7 has two built-in CAN interface and supports 2.0A and 2.0B (active) specifications. Its communication rate reaches up to 1Mbit/s to ensure reliable real-time communication, helping to expand automotive applications. APM32F103RCT7 is certified with AEC-Q100 and meets automotive reliability standards. It has passed IEC61508 SIL3 with stable quality and high reliability. Its operating temperature covers -40℃ to 105℃, with the ability to adapt to complex environments.
Application
It has been successfully applied in automotive fields such as audio and video system, navigation, central control, battery management system, intelligent cockpit, sound simulation, ADAS, and EDR.
2) Product: APM32F072RBT7
Description
Based on the Arm® Cortex®-M0+ core, APM32F072RBT7 operates at 48MHz and features 128KB flash and 16KB SRAM. With built-in USART, I2C, SPI, I2S, USB, CAN, HDMI CEC, and other rich peripheral resources, it supports simultaneous and independent USBD and CAN working modes. It provides up to 80 bi-directional I/Os, all mappable on external interrupt vectors.
Unique advantages
APM32F072RBT7 features a USB2.0 full-speed interface without external crystal and supports BCD and LPM, and up to 24 capacitive sensing channels. Its HDMI CEC meets the advanced control needs of automotive audio and video intelligent terminals. APM32F072RBT7 has passed certified USB-IF and AEC-Q100, meeting automotive reliability standards. Its operating temperature covers -40℃ to 105℃, with the ability to adapt to complex environments.
Application
It has been widely used in blind spot detection, alarm, car central control, battery management system, car DVR and other fields.
Prospect
Geehy Semiconductor is committed to the development and innovation of industrial-grade and automotive MCUs, sensors, high-performance analog IC, BMS, and other chip products. In 2022, Geehy is expecting to have several products certified by AEC-Q100 and is also actively promoting the development of new automotive MCUs that comply with ISO26262 standards. In the future, Geehy's products will be dedicated to the ECU market, intelligent cockpit, BMS, and LIDAR.
Product: GT24C512B Automotive Standard Grade 1 EEPROM
Description
GT24C512B is a highly reliable EEPROM product with Giantec's proprietary intellectual property rights.
Photo credit: Giantec Semiconductor
Key Features:
Two Wire Serial Interface, I2CTM Compatible
– Bi-directional data transfer protocol
● Wide-voltage Operation
– VCC= 1.7Vto 5.5V(-40℃ to125℃)
● Speed: 1 MHz
● Standby current(max.): 1mA, 1.7V
● Operating current(max.): 1.5mA, 1.7V
● Hardware Data Protection
– Write Protect Pin
● Sequential & Random Read Features
● Memory organization: 65,536x 8 bits
● Page Size: 128bytes
● Page write mode
– Up to 128bytes per page write
● Self-timed write cycle with auto-clear: 5ms (max.)
● Filtered inputs for noise suppression
● With ECC function
● High-reliability
– Endurance: 4million cycles at 25℃
● 1 million cycles at 125℃
– Data retention: 100 years at 25℃
● Compliant with automotive standard AEC-Q100 grade 1
● Packages: SOIC, TSSOP, and UDFN
● Lead-free, RoHS, Halogen-free, Green
Unique advantages
This product is the first auto-grade 1 EEPROM product in China. By means of built-in ECC, it can greatly reduce the error rate and meet the requirements of high yield in the automotive industry. The product's erasures times, data retention, power consumption, speed, and other main parameters hold global competitiveness, making up for the domestic market.
Application
The products can be widely used in the automotive fields like EIC systems, BCM/DCM, visual perception systems, intelligent cockpit systems, etc.
Prospect
The current trends of electrification, autonomous driving, and connectivity in the automotive industry stimulate the development of the entire automotive electronics market, driving the prospects of the automotive memory chip market. On the other hand, the shortage of chips and the wave of domestic substitution also provide a good opportunity for domestic enterprises.
Giantec gives full play to its technological advantages and continues to increase R&D and production investment in the automotive EEPROM field. We have received a Certificate of Compliance from an accredited third-party organization for our compliance with IATF 16949:2016 Automotive Quality Management System. Products involving functional safety meeting different grades of ISO26262 are also under development. By the end of 2022, the company can fully improve the whole series of Grade 1 (125℃ )products, so as to meet the increasing needs of different designs and mass production of vehicle parts manufacturers.
Product: AEC-Q100 Flash Memory (GD25/55 SPI NOR Flash & GD5F SPI NAND Flash)
Description
GigaDevice’s product line of SPI NOR Flash and SPI NAND Flash Memory has passed the AEC-Q100 qualification. Consisting of high-performance and high-reliability flash memory solutions for factory-installed and special vehicle applications that require automotive quality, the GD25/55 series SPI NOR Flash and GD5F series SPI NAND Flash Memory are in mass production.
Photo credit: GigaDevice
Unique advantages
The GD25/55 series SPI NOR Flash Memory features density from 2Mb to 2Gb, with a 3.0V or 1.8V power supply, operating temperature range of -40℃~85℃, -40℃~105℃, or -40℃~125℃, and automotive qualified package options. The GD25 series, which has been proven in the field for years, consists of high-performance and high-reliability flash memory solutions for factory-installed and special vehicle applications that require automotive quality.
The GD5F series SPI NAND Flash Memory features a density from 1Gb to 4Gb, with a 3.0V or 1.8V power supply, a -40℃~105℃ operating temperature range, and is available in an automotive-grade WSON8 8x6mm package. The high-density and high-reliability GD5F series has been proven in the field for years and is ideal for factory-installed and special applications requiring automotive quality.
Application
The GD25/55 series SPI NOR Flash is widely used in in-vehicle video/audio, assisted driving, battery management, charging management, domain control, and other units. GD5F series SPI NAND Flash provides 1Gb~4Gb large density options, which can further expand the capacity of GD25 SPI NOR Flash series, offering large-capacity and cost-effective solutions for applications such as in-vehicle gateways, DVRs, smart cockpits, Tboxes program, etc.
Prospect
Intelligent vehicles and vehicle networking are two transformative industry trends which bring enormous growth opportunities for the automotive grade memory products. Technologies such as SOTA (Software-over-the-air) and MaaS (Mobility as a service) came to life, generating new demands on the program stored in the vehicle and the amount of data processed. As a hardware layer NOR Flash Memory is mainly for program code storage, which can support the startup of the automotive electronic application software layer. Its value is irreplaceable. It is expected that the automotive electronics market will exceed 10 billion yuan per year, becoming the most important branch market of NOR Flash Memory. As an expansion of the density range, SPI NAND Flash can provide customers with more abundant and cost-effective product choices based on SPI NOR Flash.
Product: FORESEE Automotive UFS
Description
Longsys's delivery center has deployed a professional production supply chain specifically to meet the grading requirements of automotive products and is sufficient to support the professional production supply chain for current and future business development. The company's stocking and backup operations are strengthened by management in every step of the process, from client requirements, product development, and material selection to production and delivery, to ensure that clients' requirements are met.
Photo credit: Longsys
FORESEE has established the memory chip architecture, firmware development, hardware design, packaging technology, and system testing modules. This enables clients' ideas to be brought to life and applied to storage products without delay. The brand offers several technical customizations for its automotive storage products, such as mirror dash cams and automotive memory that is water-proof, dust-proof, and shock-proof, among other innovative applications. It can therefore provide services with differentiated customization for different automotive clients. A wide range of customization options are available for automotive storage products, including but not limited to chip appearance, software partitioning, pSLC, and encryption. These tailored services offer clients several advantages, including easy application, short production cycle, and controllable cost.
Unique advantages
FORESEE, an industrial storage brand under Longsys previously launched an automotive eMMC that gained widespread market recognition. In 2022, it launched an automotive UFS, one of the few AEC-Q100 qualified UFS products in China.
The FORESEE automotive UFS comes in two major capacity options: 64GB and 128GB. This product can operate in temperatures from -40°C to 105°C (Grade 2) and meets the requirements of automotive operating environments. It is environmentally tolerant and resistant to temperature changes, as well as electrostatic and electromagnetic interference. Its high reliability and long service life allow it to operate around the clock for extended periods.
This product is compatible with mainstream platforms and supports numerous features such as low-density parity-check code (LDPC) algorithms, Write Booster, HPB, emergency power failure protection, field firmware updates (FFUs), and free block acceleration (FBA) to meet market demands.
Its unique device status monitoring system allows hosts to view the running status and lifespan of storage components at any time simply by using standard commands. In addition to facilitating maintenance and advance warnings, this system ensures both device and data security.
Application
The product is mainly used in various terminal devices such as dashboard cameras, in-vehicle DVRs, multimedia vehicle entertainment systems, streaming rear-view mirrors, and T-Boxes. It is also used in advanced driver-assistance systems (ADAS), panoramic cameras, centrally controlled navigation systems, as well as electric vehicle charging infrastructure (EVCI) for cars, trucks, and industrial and commercial vehicles.
Prospects
Longsys has many high requirements in addition to broadly ranging, highly complex product use cases. Leveraging these advantages, Longsys has carved out a niche in the Chinese automotive storage market. All current products in FORESEE's automotive range have passed the wide-temperature test. Additionally, fixtures have been independently developed to enhance product reliability using high-standard testing methods. FORESEE will continue to enhance the storage performance of its products as they are integrated into the those of global automotive electronics manufacturers. FORESEE will support its global customers to a high standard and lead them with high requirements to provide better services. FORESEE will also develop new products that are more valuable and showcase new, more vibrant ideas for the automotive electronics, industrial, and automation markets.
1) Product: Snapdragon Ride Platform
Description
The Snapdragon Ride Platform is one of the automotive industry’s most advanced, scalable, and open autonomous driving solutions, which consists of the family of Snapdragon Ride Safety system-on-chips (SoCs), Snapdragon Ride Safety Accelerator, and Snapdragon Ride Autonomous Stack.
Photo credit: Qualcomm
Snapdragon Ride aims to address the complexity of autonomous driving and ADAS by leveraging its high-performance, power-efficient hardware, industry-leading artificial intelligence (AI) technologies, and pioneering autonomous driving stack to deliver a comprehensive, cost and energy-efficient systems solution.
In January 2021, Qualcomm announced the expansion of its Snapdragon Ride Platform portfolio with new safety-grade SoCs for NCAP Level 1 ADAS Windshield-Mount to Level 4 Automation Levels. In January 2022, Qualcomm launched the Snapdragon Ride Vision System – a new open, scalable, and modular computer vision software stack, designed for an optimized implementation of front and surround cameras for ADAS and automated driving AD.
Unique advantages
The Snapdragon Ride platform portfolio is comprised of one of the automotive industry’s most advanced, scalable, and highly customizable automated driving SoC platforms, engineered to not only support automakers and Tier-1s to produce more power-efficient and thermal designs but to also provide alternatives for customization opportunities, while also charting a course for next-generation automotive architecture evolution.
Snapdragon Ride now scales from 10 Tera Operations Per Second (TOPS) for windshield-mount ADAS cameras in a sub-5W power budget to over 700 TOPS for fully automated driving solutions. Snapdragon Ride offers an open programmable framework that allows automakers and Tier-1 suppliers to customize the platform for their unique requirements for camera perception, sensor fusion, drive policy, automated parking, driver monitoring, and more. To accelerate the deployment of cutting-edge ADAS/AD solutions, Snapdragon Ride continues to expand its software ecosystem with various industry-proven and leading stacks for visual perception, parking, and driver monitoring. These SoCs are expected to provide global automakers and Tier-1 suppliers with an opportunity to select one or a combination of these various stacks based on Snapdragon Ride.
The latest addition to the Snapdragon Ride Platform portfolio – the Snapdragon Ride Vision System combines the purpose-built, high-performance Snapdragon Ride SoCs with the next generation vision perception software stack from Arriver, and supports flexible deployment options with its ability to scale from entry-tier New Car NCAP front camera applications to higher levels of automation that require comprehensive front and surround-view camera applications, allowing for a common implementation of features and requirements, with functional safety/SOTIF support, across virtually all vehicle tiers and types.
The Snapdragon Ride Vision System offers a uniquely designed modular architecture to extend the flexibility for automakers to integrate map crowdsourcing, driver monitoring system (DMS), parking systems, and cellular vehicle-to-everything (C-V2X) technologies and localization modules to support better customization and up-integration.
Application
The unique combination of Snapdragon Ride SoCs, accelerator, and autonomous stack offers automakers a scalable solution designed to support three industry segments of autonomous systems：
● L1/L2 Active Safety ADAS for vehicles that include automatic emergency braking, traffic sign recognition, and lane-keeping assist functions;
● L2+ Convenience ADAS for vehicles featuring Automated Highway Driving, Self-Parking and Urban Driving in Stop-and-Go traffic;
● L4/L5 Fully Autonomous Driving for autonomous urban driving, robo-taxis and robo-logistics.
Prospect
Since its introduction in 2020, Snapdragon Ride has gained momentum with global automakers and Tier-1 suppliers who are currently developing their next-generation fleets with Snapdragon Ride. Along with the SoC family, Snapdragon Ride brings an industry-proven vision stack for the front, and surround camera systems and a driving stack that is seamlessly integrated with an SDK and cloud-enabled toolchain, comprised of multi-sensor fusion, map-based localization, planning, and prediction systems to support NCAP to L3 driving systems.
Snapdragon Ride-based SoC and Accelerator L2+ to L4 platforms are expected to be available in production vehicles beginning in 2022. Snapdragon Ride SoCs for NCAP to L2+, with integrated stacks, are planned for 2024 production programs.
2) Product: 3rd Generation Snapdragon Cockpit Platform
Description
As Qualcomm’s first-announced scalable artificial intelligence (AI)-based platforms, the 3rd Generation Snapdragon Cockpit Platforms are designed to transform in-vehicle experiences, supporting higher levels of computing and intelligence needed for advanced capabilities featured in next-generation vehicles, including highly intuitive AI experiences for in-car virtual assistance, natural interactions between the vehicle and driver, and contextual safety use cases.
Photo credit: Qualcomm
Utilizing precise positioning for enhanced navigation solutions, and cutting-edge technologies for immersive audio and rich visual experiences, the 3rd Generation Snapdragon Cockpit Platform is designed to unleash transformative experiences for the driver and passengers.
The 3rd Generation Snapdragon Cockpit Platforms has a new tiering system comprised of Performance, Premiere, and Paramount classes for the entry-level, mid-tier, and supercomputing platforms, respectively.
Currently, the models annoucned to equip with the 3rd Generation Snapdragon Cockpit Platform include Great Wall Motor's third-generation Haval H6, WEY Mocha, WEY Latte, WEY Macchiato, Geely Xingyue L, BYD D1, Chery Jetour X70 PLUS, LEAPMOTOR C11, NIO ET7, IM L7, WM Motor W6, XPeng P5, XPeng G9, HiPhi X, HiPhi Z, Li Auto L9, and Rising Auto R7, etc.
Unique advantages
Qualcomm's first-announced AI-powered automotive-grade scalable cockpit platforms, powered by Qualcomm's most advanced heterogeneous compute platform for the automotive sector
Building on the technology introduced with multi-generation Snapdragon Cockpit Platforms, the 3rd Generation Snapdragon Cockpit Platforms are engineered with immersive graphics, multimedia, computer vision, and artificial intelligence capabilities. The new platforms feature integrated heterogeneous computing capabilities, leveraging the multi-core Qualcomm AI Engine, Qualcomm Spectra Image Signal Processor (ISP), fourth-generation Qualcomm Kryo Central Processing Unit (CPU), Qualcomm Hexagon Processor, and sixth-generation Qualcomm Adreno Visual Subsystem. The Qualcomm AI Engine optimizes the AI capabilities of all primary Snapdragon cores including CPU, GPU, and the Hexagon Processor. The all-new Hexagon Processor includes Hexagon Vector eXtensions (HVX) and a dedicated Hexagon Tensor Accelerator (HTA) to provide exceptional AI acceleration for a more power-efficient implementation of edge-based machine learning use-cases such as Natural Language Processing and Object classification.
The 3rd Generation Snapdragon Cockpit Platforms also feature the Qualcomm Secure Processing Unit (SPU), engineered to help protect personal and vehicle data, and Qualcomm Vision Enhanced Precise Positioning based camera sensors and computer vision capabilities to support differentiated use-cases on lane-level crowdsourcing of drive data for building map layers.
Unified software framework, highly flexible and scalable
The 3rd Generation Snapdragon Cockpit Platforms include virtualization support compatibility with leading hypervisor solutions to address the domain convergence of infotainment and instrumentation systems, helping automakers meet the increasing complexity demanded by the consolidation of the digital cluster and infotainment domains. These new platforms also leverage the same software architecture and framework across all tiers allowing automakers to offer a harmonized user experience independent of the vehicle tier while leveraging the same software framework. The new platforms also offer comprehensive software support for Android, LINUX high-level, and other real-time operating systems, providing flexible and scalable software solutions to support mixed-criticality solutions, multiple engine control unit (ECU) consolidations, one-to-many high-resolution and refresh rate displays, basic audio to multi-zone, luxury Hi-Fi with multi-mic echo cancellation and noise reduction for voice calls and user interface interaction, and state-of-the-art 2D and 3D graphic visualization for vehicle occupants to utilize connected services information and enjoy protected movie and entertainment content.
Comprehensive wireless technologies support
The 3rd Generation Snapdragon Cockpit Platforms feature an advanced suite of wireless technologies to support multi-mode cellular connectivity, Wi-Fi 6, as well as enhanced Bluetooth technologies.
Application
The 3rd Generation Snapdragon Cockpit Platforms transform in-vehicle experiences featuring high-performance computing, immersive graphics, and enhanced multimedia for all vehicle tiers， supporting automakers to rapidly develop high-performance, energy-efficient automotive digital cockpit platforms and accelerating innovation in the automotive industry.
Comprehensive technology capabilities to support automakers in bringing high-quality immersive driving experience to users
● Highly Intuitive AI Experiences: Qualcomm AI Engine for driver and passenger personalization, in-car virtual assistance, natural voice control, language understanding, and adaptive human-machine interfaces.
● Contextual Safety for intelligent driving assistance systems, including in-cabin monitoring and ultra-HD surround view monitoring.
● Smarter Navigation: lane-level navigation with visual aid positioning and multi-frequency global navigation satellite system (GNSS) to support augmented reality-based navigation systems.
● Rich Visual Experiences: support for multiple displays throughout the vehicle, including ultra-wide panoramic displays, reconfigurable 3-D digital instrument clusters, augmented reality heads-up display (HUD), and ultra-HD media streaming.
● Immersive Audio: provides premium audio experiences, including personalized multi-audio zones customized for each user, crystal clear in-car communication, and active noise and echo cancellation with engine noise suppression capabilities.
Highly integrated development kits that provide a complete hardware and software environment for rapid product development, accelerating innovation in the automotive industry
● The automotive ecosystem can evaluate, demonstrate and develop third-generation automotive solutions leveraging the Qualcomm Snapdragon Automotive Development Platform (ADP). Based on the 3rd Generation Snapdragon Cockpit Platforms, the highly integrated Snapdragon ADP is designed to provide a comprehensive hardware and software environment for the rapid development of high-performing and power-efficient automotive cockpit platforms.
● The ADP is designed in a single DIN form-factor and mechanical housing for easy prototyping in cars and features support for Android and LINUX high-level and real-time operating systems and hypervisor virtualization support, as well as support for multiple high-resolution displays and cameras, including driver monitoring and surround-view cameras.
Prospect
In response to the "Electrified, Autonomous, Connected and Shared" transformation in the auto industry, leading automakers are redefining cars and promoting business model innovation through cutting-edge technologies and innovative electrical and electronic architecture design to meet consumers' new expectations for the future automotive, creating a diverse digital experience and safe, efficient and intelligent travel experience. Qualcomm's multi-generation solutions bring powerful compute capabilities for multiple 4K displays, top-notch audio and video, streaming entertainment, and contextual safety in the car, continuously promoting the driving experience upgrade and gaining wide recognition from the automotive industry.
Qualcomm is currently ranked number one in telematics, automotive connectivity, and next-generation premium infotainment systems. All major global automakers have selected the Snapdragon Cockpit Platforms. Many domestic and international automakers, including Audi, Jaguar, Land Rover, Volvo, Honda, General Motors, Renault, Li Auto, Lynk&Co, XPeng, GAC, Haval, BYD, Chery Jetour, LEAPMOTOR, NIO, WEY, HiPhi, Evergrande Auto, IM Motors, ZEEKR, SAIC MG, Geely, WM Motor, and JiDU, have launched or announced vehicles powered by the Snapdragon Cockpit Platforms.
Product: Quectel Automotive Grade AP Module AG215S
Description
Quectel automotive application processor module AG215S has superior computing power and is optimized for V2X applications.
Photo credit: Quectel
Unique Advantages
● Embedded hardware engine fulfills powerful ECDSA verification capability
● Support global and China national security algorithms
● Dedicated HSM/SE and optional ITS protocol stack integrated
● Meet different requirements of computing power with flexible configuration
Application
The AG215S module is able to run V2X ITS protocol stack and applications smoothly, and complete signature verification for thousands of times per second. The module can be used in combination with 5G modules to implement as C-V2X Application Processor to host ITS stack and applications. It provides automotive industry application solutions with more functions and further extended communication range, especially enabling C-V2X for traffic safety and efficiency to meet enhanced driving safety, autonomous driving, intelligent transport system (ITS), and advanced driver-assistance system (ADAS) application demands. Quectel automotive modules will make traffic smoother and more efficient by paving the way for automated driving and achieving the goal of fully connected traffic.
Prospect
With the rapid development of connected vehicles, V2X technology has gradually entered mass production, and the demand for V2X application processors is rapidly increasing. As a mainstream application processor module, the AG215S will play a major role in the auto field. At the same time, as an extension of computing power, it supports vehicular applications with different computing power requirements. For low computing power requirements, customers can directly use the default computing power integrated into the traditional communication module. Meanwhile for higher computing power requirements, AG215S can be adopted as an extension of computing power, which supports flexible configuration to maximize the data processing needs of the Internet of vehicles.
Product: integrated low power management and fault diagnosis 5Mbps CAN FD transceiver chip SIT1043
Description
SIT1043 is an interface chip used between the CAN protocol controller and the physical bus. It can be used in trucks, buses, cars, industrial control, and other fields. It supports a 5Mbps flexible data rate (Flexible Data-Rate). Its ability of differential signal transmission between CAN protocol controllers is fully compatible with the "ISO 11898-2: 2016" standard.
Photo credit: Silicon Internet of Things
Features
● Reliable communication at high data rates with loop delay
● Suitable for 12 V and 24 V systems
● Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
● Listen-only mode
● Very low current Standby and Sleep modes
● Local and remote wake-up
● Bus ±70V withstand voltage
● ±30V receiver common mode input voltage
● IO port supports 3.3V/5V MCU
● Driver (TXD) dominant timeout function
● Undervoltage protection on VBAT, VCC and VIO supply pins
● High Speed CAN, Support 5Mbps CAN With Flexible Data Rate
● Sleep mode INH output pin with power disable function
Unique advantages
The SIT1043 can detect four kinds of local error events: TXD dominant timeout, TXD and RXD short circuit, bus dominant timeout, and over-temperature protection. Whenever any of these events occur, a local error flag is generated, and when the device transitions from normal operating mode to silent mode, ERRN is pulled low, indicating that a local error flag has occurred.
The INH pin is pulled high in normal working mode, silent mode, standby mode, and sleep-wait mode; in sleep mode, the pin is in a high-impedance state.
Over-temperature protection
SIT1043 has an over-temperature protection function. After the over-temperature protection is triggered, the driver tube will be turned off. Because the driver tube is the main energy-consuming component, turning off the driver tube can reduce power consumption and thus reduce the chip temperature. At the same time, other parts of the chip still keep working normally.
Undervoltage protection
SIT1043 has an under-voltage detection function on the power supply pin. When VCC is lower than VuvdVCC and the under-voltage time is greater than tUVD_VCC or VIO is lower than Vuvd_VIO and the under-voltage time is greater than tUVD_VIO, the device will enter sleep mode, which can save power consumption and avoid bus undisturbed, in sleep mode, the INH pin will be pulled high. Standby mode is entered when VBAT is below Vuvd_VBAT and the transceiver will be disconnected from the bus (zero load). When the voltage at pin VBAT is restored, the transceiver will switch to the operating mode indicated by the logic levels on the STBN and EN pins.
Control Mode
Through the control pins EN and STBN, the SIT1043 can be selected to enter different working modes: normal working mode; listen-only mode; standby mode; enter sleep mode; sleep mode.
Dominant timeout function
In high-speed mode, if a low level on pin TXD lasts longer than the internal timer value (tdom_BUS), the transmitter will be disabled, driving the bus into a recessive state. This prevents the bus line from being driven to a permanent dominant state (blocking all network traffic) due to a hardware or software application fault on pin TXD being forced permanently low. A rising edge signal on pin TXD can be reset.
Wake up function
SIT1043 has local wake-up and remote wake-up functions.
Application
Vehicle, BMS, BCM, OBD, AVAS, ADAS, TBOX, OBC
Prospects
It will be widely used in various ECU modules of new energy, which plays a very important role in saving power consumption and increasing the endurance of new energy vehicles
Product: High Reliability and High Safety Microcontroller
Description
The product is designed under strict automotive design procedures and meets the high-reliability AEC-Q100 Grade1, high functional safety ASIL-D, and cyber-security requirements. It uses the latest ARM microcontroller architecture and achieves the highest performance in China.
Photo credit: YTMicro
Unique advantages
It provides high reliability, high functional safety, and cyber security, achieving a lower failure rate to 10PPM.
Application
BCM, BMS, sensor control, ADAS Safety MCU, OBC, VCU, Tbox, Matrix Headlamp
Prospects
With the increase of new energy smart vehicles, auto-grade microcontrollers are expected to grow by double digits in volume for five consecutive years. The overall domestic market size will exceed 60 billion yuan by 2030. The current market share of domestic microcontroller companies is less than 2%. As a leading company in the field, Yuntu Microelectronics has a broad market and good future.
Product: Silicon based devices,SiC devices, and GaN devices
Description
The company's strategy focuses on the design and market development of automotive-grade power devices. By establishing a long-term supply guarantee system with first-class foundries, it can better serve the domestic automotive industry chain.
Photo credit: ZMJ Semiconductors
Unique advantages
The company's design team is composed of a small number of designers who are the world's earliest participants in automotive Trench MOSFET and Double-Gate MOSFET, FS-IGBT, RC-IGBT, and have rich experience in mass production development and long-term car factory use records.
Application
Electric vehicles, motor drives, new energy, energy storage, consumer electronics
Prospect
At the present, opportunities and challenges coexist in China's semiconductor industry. Zhenmaojia will seize the once-in-a-lifetime domestic substitution opportunity, take advantage of the window period, continue to carry forward the spirit of craftsmanship, focusing on automotive power semiconductors, polish products, continue product innovation, and iteration, raising automotive investment in the field. The win-win cooperation with partners will provide efficient solutions for smart and low-carbon life, helping Zhenmaojia become a first-class semiconductor company in the industry, based in China and reaching the world!
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