Dongfeng Motor-led chip consortium sees three automotive chips complete tape-out

Beijing (Gasgoo)- Hubei Province's Chip Industry Technology Innovation Consortium, spearheaded by Dongfeng Motor Corporation, saw three domestically-developed automotive-grade chips sail through trial production.

Photo credit: Dongfeng Motor

In May of last year, Dongfeng Motor Corporation led a collaborative effort with eight other entities, including CICT, Wuhan LinControl Automotive Electronics Systems, Wuhan University of Technology, Huazhong University of Science and Technology, Nuclei System Technology, and TKD Science and Technology, to establish the "Hubei Province Chip Industry Technology Innovation Consortium." 

The consortium's primary objective is to promote localized chip supply chains and elevate Hubei Province to a national-level hub for the automotive semiconductor industry. Currently, the consortium has expanded its membership to include 19 entities, such as ZTE and Black Sesame Technologies, alongside six expert committee members.

According to reports, Dongfeng Motor Corporation took chip demands into account when analyzing needs and system design, module design, and verification in collaboration with other members of the consortium. After fabrication and testing at the wafer encapsulation factory, and completing automotive-grade chip testing, the chips will be mass produced and deployed onto Dongfeng Motor’s vehicles.

Dongfeng envisions achieving a 40% domestication rate for chips in its new vehicle models in the future, ensuring that these automotive-grade chips will not only be integrated into Dongfeng-branded vehicles but also be widely applied to other domestic brands.