Desay SV, Infineon co-inaugurate innovation application center in Huizhou city

Beijing (Gasgoo)- On December 4, Desay SV and Infineon held a signing and inauguration ceremony for the DESAY SV-INFINEON Innovation Application Center in Huizhou city, Guangdong province. In the meantime, the two companies inked a memorandum of understanding for cooperation on intelligent driving domain controllers.

Inauguration ceremony; photo credit: Desay SV

The new center represents a significant collaboration platform, reflecting the deep strategic alignment and vision of both companies, and marks an upgrade to their decade-long partnership.

Currently, the two companies are leveraging the Innovation Application Center to define MCU chip architectures for future electrical and electronic architectures (EEA), while conducting performance testing and reliability evaluations for Infineon's TC4x MCU devices. These efforts aim to provide innovative solutions to clients.

Looking forward, Desay SV and Infineon plan to jointly develop technologies in two critical areas—intelligent driving and cockpit systems—to accelerate the commercialization of new products and solutions.

With over ten years of collaboration, Desay SV and Infineon have established a strong foundation for partnership. As a rapidly growing Tier 1 supplier, Desay SV brings agile R&D capabilities, robust system integration expertise, and extensive experience in product applications and mass production. These strengths enable the company to anticipate industry trends and customer needs, offering valuable real-world scenarios and market feedback for co-developed innovative technologies.