Gasgoo Munich- SiEngine has closed a new strategic funding round exceeding $200 million in the first half of this year. New backers include Shandong Hi-speed Group, Longding Investment, Zhuoyuan Asia, Weihua Group, Qingdao City Investment, Haifa Group, and the Wuhan Jiangcheng Fund, alongside continued support from several existing investors.
Image Source: SiEngine
The investor roster spans five sectors: automotive semiconductors, smart transportation, industrial manufacturing, regional industry, and AI chips. Shandong Hi-speed Group is set to open its provincial road network, offering real-world test scenarios for SiEngine's vehicle-to-infrastructure and autonomous driving technologies. Meanwhile, Weihua Group—leveraging its global strength in industrial lifting equipment—could accelerate the deployment of SiEngine's industrial AIoT chips. Longding Investment and Zhuoyuan Asia are providing support from the perspectives of the broader vehicle ecosystem and AI technology, respectively.
The Wuhan Jiangcheng Fund doubled down, reinforcing SiEngine's status as a local "chain leader" in the industry. The addition of Qingdao City Investment and Haifa Group will help SiEngine tap into industrial resources and talent in the Bohai Rim region, paving the way for its northern market expansion. Existing investors—including Shengshi Investment, Jingming Capital, and Huiyou Capital—increased their stakes, largely driven by the market performance of SiEngine's mass-produced "Longying-1" cockpit chip.
Image Source: SiEngine
SiEngine ranks first among Chinese automotive SoC suppliers for cockpit domain controller shipments in 2025, according to Frost & Sullivan. The chip has been integrated into dozens of models, including those from Lynk & Co, Galaxy, FAW Hongqi, Changan Qiyuan, and Volkswagen's overseas lineup, with cumulative shipments exceeding 1 million units.
Image Source: SiEngine
During the Beijing Auto Show, SiEngine unveiled the 5-nanometer "Longying-2," a cockpit-and-driving fusion chip with 200 TOPS of AI computing power, scheduled for adaptation in the first quarter of 2027. The move is viewed as a critical step in SiEngine's pivot from in-vehicle computing to edge intelligence. The technical expertise accumulated in automotive-grade chips—specifically in high computing power, bandwidth, and safety—holds reusable value for scenarios like industrial robotics and embodied AI.
Wang Kai, CEO of SiEngine, noted that continued investor trust is vital as the company scales up. Moving forward, the focus will be on accelerating the delivery of automotive chips while advancing the commercialization of industrial intelligent chips.
