CES 2026 opened in Las Vegas on January 6, marking Black Sesame Technologies' fifth appearance at the show. The company spotlighted advances in assisted driving, embodied intelligence and consumer electronics, outlining plans to drive intelligence across industries with AI chip technology.
Interactive demo of a VLM model powered by the Huashan A2000; Image source: Black Sesame Technologies
In automotive, Black Sesame Technologies publicly demoed — for the first time — generalist assisted driving across all scenarios on the Huashan A2000. It uses a big-core architecture co-designed with algorithms and integrates the latest Jiushao NPU. After system-level optimization, the chip delivers measured performance on par with top intelligent driving chips globally. It will support smart assisted driving applications such as VLM/VLA, as well as in-cabin AI Box use. The Huashan line is already in mass-production partnerships with Dongfeng Motor, Geely, Hongqi and JAC, among others. The A2000 recently cleared relevant U.S. reviews, officially entering global markets.
Banma Information Technology's cockpit-driving integrated edge AI solution based on C1296; Image source: Black Sesame Technologies
Also debuting was the Wudang C1296 production-ready cockpit-driving solution, co-developed by Dongfeng Motor and JOYNEXT. It uses a single chip to support the digital instrument cluster, smart cockpit and assisted driving. The Wudang series has helped drive the shift toward cross-domain integration in automotive E/E architectures. Dongfeng Motor, Continental, Banma Information Technology Intelligent and JOYNEXT have launched highly integrated cross-domain production solutions based on Wudang chips — helping shape industry trends.
Rovar X3, the dual-wheel-legged outdoor companion robot based on the SesameX platform; Image source: Black Sesame Technologies
On embodied intelligence, Black Sesame Technologies staged its first overseas showcase of the SesameX multi-dimensional embodied intelligence computing platform. Covering the Kalos, Aura and Liora series, it provides a scalable compute base for robots of different forms. Onsite demos included the dual-wheel-legged outdoor companion robot Rovar X3, the Fourier dexterous hand and a waste-sorting robotic arm — signaling progress toward commercial deployment of robotics.
In consumer electronics, devices running Black Sesame Technologies' AI imaging solutions have surpassed 500 million units globally. The company recently acquired a controlling stake in Yizhi Electronics to integrate its low-power AI SoC technology. Li Auto's first AI glasses, Livis, use the solution, supporting algorithms such as HDR fusion, multi-frame denoising and video stabilization. The CES booth also featured the Lingdu 4K streaming dashcam, the Haohan M7 smartphone gimbal, the Insta360 Flow 2 Pro stabilizer and the Zuoyebang learning pen.
Through this year's CES, Black Sesame Technologies extended from intelligent driving chips into cross-domain computing, embodied intelligence and consumer AI solutions — further consolidating a multi-dimensional intelligent chip portfolio.
