SemiDrive, Richtek co-launch SD210 cockpit reference design

Beijing (Gasgoo) – SemiDrive, a Chinese automotive-grade chip product and solution provider, announced on July 3 via its WeChat account that it had launched the "SD210" reference design platform, a pre-integrated solution tailored for next-generation smart cockpit systems, in partnership with the analog IC design firm Richtek.

photo credit： SemiDrive

The SD210 reference design is built on SemiDrive's X9H, X9HP, and X9SP smart cockpit SoCs, and integrates Richtek's SoC PMIC RTQ2209, Multi-Phase Step-Down Converter RTQ2134, DCDC RTQ2102A, and LDO RTQ2531A. It supports output voltage configuration and power sequencing via internal IC memory (MTP/OTP), enabling efficient and flexible power delivery tailored to specific circuit requirements. Thanks to the pin-compatible nature of the supported SoCs, system specifications can be upgraded swiftly without any hardware redesign.

Richtek has introduced the RTQ2209-QA, a newly developed analog IC designed specifically for automotive-grade applications. Featuring an advanced wettable flank QFN6x6 package, the RTQ2209-QA integrates 10 configurable power rails and supports I2C-based flexible configuration. It offers an ultra-low quiescent current of just 50μA, and achieves exceptionally low power consumption in STR mode, significantly enhancing system efficiency and extending battery life.

In addition, for high-power automotive platforms, Richtek provides advanced solutions such as 20A multi-phase and four-channel buck converter RTQ2134-QA, addressing more demanding performance requirements.

To address the diverse configuration requirements of cockpit systems, Richtek offers four tailored power supply solutions optimized for SemiDrive’s X9SP, X9HP, and X9H SoCs. These solutions fully leverage the high level of integration provided by the RTQ2209, enabling simplified circuit design, reduced board space, and ease of implementation—ideal for meeting the smart cockpit system's demand for compact, streamlined, and efficient power architectures.

Solution A for X9SP/X9H/X9HP Configuration 1：

Designed for systems equipped with an MCU and using DRAM LP4, this power solution consists of the RTQ2209 and RTQ2134. The MCU controls both components via GPIO and I2C interfaces. In this configuration, the RTQ2209 supplies power to the RTC, SAF, DRAM, and GPU, while the RTQ2134 powers the AP and CPU.

photo credit：SemiDrive

Solution A for X9SP/X9H/X9HP Configuration 2：

This power solution is designed for systems equipped with an MCU and using DRAM LP4x. It consists of the RTQ2209, RTQ2134, and RTQ2102A, all controlled by the MCU via GPIO and I2C interfaces. In this configuration, the RTQ2209 supplies power to the RTC, SAF, GPU, and LP4x DRAM; the RTQ2134 powers the AP and CPU; and the RTQ2102A provides dedicated power to the LP4x.

photo credit：SemiDrive

Solution B for X9SP/X9H/X9HP Configuration 3：

This power solution is designed for systems without an MCU and using DRAM LP4. It consists of the RTQ2209, RTQ2134, and RTQ2531A, with the X9SP/X9H/X9HP SoCs controlling the RTQ2209 and RTQ2134 via GPIO and I2C interfaces. In this setup, the RTQ2209 supplies power to the SAF, DRAM, and GPU; the RTQ2134 powers AP and CPU; and the RTQ2531A provides power to the RTC domain.

photo credit：SemiDrive

Solution B for X9SP/X9H/X9HP Configuration 4：

This power solution is designed for systems without an MCU and utilizing DRAM LP4x. It comprises the RTQ2209, RTQ2134, RTQ2102A, and RTQ2531A, with the X9SP, X9H, or X9HP SoCs managing the operation of RTQ2209, RTQ2134, and RTQ2102A via GPIO and I2C interfaces. In this configuration, the RTQ2209 delivers power to the SAF, GPU, andLP4x; the RTQ2134 powers the AP and CPU; the RTQ2102A provides dedicated power to the LP4x; and the RTQ2531A supplies power to the RTC domain.

photo credit：SemiDrive