- SemiDrive, ROHM co-develop automotive SoC reference design
Chinese automotive chip developer SemiDrive and renowned global semiconductor manufacturer ROHM have jointly developed a reference design called "REF66004" for intelligent cockpits.
Mar. 29 , 2024
- SiEngine closes Series B funding, targets million-unit shipments for SE 1000 chip in 2024
SiEngine, a Chinese provider of high-performance automotive-grade processor solutions, officially announced on March 28, that it successfully completed a Series B financing round worth hundreds of mil...
Mar. 28 , 2024
- eVTOL developer TCab Tech secures $20 million Series A financing
TCab Tech, a Shanghai-based tech company specializing in electric Vertical Takeoff and Landing (eVTOL) aircraft, announced the completion of a $20 million Series A strategic financing round on March 2...
Mar. 28 , 2024
- RoboSense’s annual revenue doubles YoY in 2023
RoboSense, a leading provider of LiDAR solutions, on March 27 released its financial report for the year ended December 31, 2023. The report reveals significant growth in revenue and sales, albeit acc...
Mar. 28 , 2024
- Unmanned delivery vehicle developer NEOLIX bags 600 million yuan in Series C financing
Chinese developer of unmanned delivery vehicles NEOLIX, recently completed a 600-million-yuan Series C financing round, according to its announcement on March 27.
Mar. 27 , 2024
- JAC Group, Huawei Device to co-boost HarmonyOS ecosystem advancement
On March 26, Chinese automaker JAC Group and Huawei Device Co., Ltd., signed a memorandum of understanding (MoU) to collaborate on the development of an intelligent information service platform.
Mar. 27 , 2024
- Xiaomi invests heavily in intelligent driving, aiming to stand among industry leaders in 2024
Lei Jun, the CEO of Xiaomi, on March 26 announced on Weibo that Xiaomi is making significant investments in the field of intelligent driving, with its R&D team already surpassed 1,000 members, and is ...
Mar. 27 , 2024
- V2X solution developer PATEO bags 19-billion-yuan credit line from seven banks in China
On March 26, PATEO, a Chinese V2X tech company, signed credit agreements with seven banks, securing a total credit line of 19 billion yuan.
Mar. 26 , 2024
