- EtlChip closes Pre-A++ funding to advance automotive Ethernet chips
On July 4, Chinese Ethernet chip developer EtlChip announced the completion of its Pre-A++ round of financing, led by Cornerstone Ventures.
July 04 , 2024
- Polar Bear Tech secures new funding to develop first independent chiplet product library
Recently, Chinese chiplet design company Polar Bear Tech announced the completion of a new round of financing, introducing V Fund as an investor.
June 12 , 2024
- NOVAUTO nabs hundreds of millions of yuan in Pre-B financing
On May 9, NOVAUTO announced the completion of Pre-B round financing, which raised for the company hundreds of millions of yuan.
May 10 , 2024
- MotionSilicon team up with arm China for auto chips R&D
MotionSilicon recently announced a collaboration with arm China.
May 10 , 2024
- IAR fully supports YTMicro’s automotive-grade MCUs
On January 26, global leader in embedded development software and services, IAR, and Chinese automotive chip manufacturer YTMicro announced a strategic cooperation.
Jan. 26 , 2024
- Meituan, NIO Capital invests in Sichain Semiconductor's Pre-B funding round
On December 28, high-end SiC power device manufacturer, Sichain Semiconductor, announced the successful completion of its Pre-B round financing, which raised for the company several hundred million yu...
Dec. 28 , 2023
- SiEngine’s SE 1000 automotive chip hits delivery milestone of 200,000 units
On December 25, SiEngine, the ECARX-backed provider of automotive electronic chip solutions, saw its 7nm high-performance vehicle-grade chip, known as the SE 1000, surpass the delivery milestone of 20...
Dec. 26 , 2023
- X-EPIC, SiEngine team up to boost automotive chip development
On December 4, X-EPIC, a system-level verification EDA solution provider, formally established a strategic partnership with SiEngine, a domestic high-end automotive chip design company backed by ECARX...
Dec. 04 , 2023
