- BYD said to seek external IGBT supplies as semiconductor unit facing tight capacity
BYD has placed an order worth over 100 million yuan ($15.762 million) to Hangzhou Silan Microelectronics Co., Ltd. (Silan), a Chinese semiconductor manufacturer, for automotive-grade IGBTs
Dec. 09 , 2021
- Black Sesame joins hands with Jingwei Hirain for autonomous driving development
China’s AI chip developer Black Sesame has joined hands with Jingwei Hirain, an electronic system supplier, to collaborate on autonomous driving and other automotive-related developments.
Dec. 08 , 2021
- ECARX forms intelligent SoC cockpit ecosystem with Desay SV, Neusoft and BDStar
Geely-backed ECARX and SiEngine Technology, ECARX’s joint venture with ARM China, have inked separate strategic partnership agreements with leading auto parts players Desay SV, Neusoft, and BDStar�...
Dec. 06 , 2021
- SoC supplier Black Sesame teams up with RTOS developer RT-Thread
China’s SoC supplier Black Sesame has formed a strategic partnership with real-time operating system developer (RTOS) RT-Thread, to construct a basic integrated computing platform for the automotive...
Nov. 26 , 2021
- SemiDrive, ZongmuTech join hands for intelligent driving application
China’s automotive SoC developer SemiDrive, has partnered with an autonomous driving solution provider ZongmuTech, with a shared goal of accelerating intelligent mobility applications for automakers...
Nov. 19 , 2021
- ECARX 7nm auto chip achieves tape-out, mass production starts next year
SiEngine Technology, the joint venture between Geely-backed ECARX and ARM China, celebrated a successful tape-out of the company’s self-developed 7-nanometer auto-grade SoC, the DragonHawk One.
Nov. 10 , 2021
- SAIC’s Z-ONE to build joint innovation hub with ZTE for auto OS, chips, 5G-V2X tech
Z-ONE signed on Oct. 26 a strategic cooperation MoU with ZTE Corporation to build a joint innovation center dedicated to the R&D of in-car operating systems, automotive-grade chips, 5G-V2X-enabled aut...
Oct. 27 , 2021
- BYD permitted by HKEX to hive off BYD Semiconductor for A-share listing
Hong Kong Stock Exchange (HKEX) confirmed on Oct. 22 that BYD Company Limited (called “BYD” or “the Company” for short) may proceed with the spin-off and separate listing of its non-wholly-own...
Oct. 26 , 2021
