- NIO-backed autonomous driving chip firm nabs $50 million from Xiaomi, etc.
RHINO ("Huixi Intelligence" in Chinese), an autonomous driving chip company co-founded by former NIO executive Zhang Jianyong, has recently completed an Angel+ round of funding with more than $50 mill...
Dec. 08 , 2022
- SemiDrive bags roughly 1 billion yuan in B+ financing round
Chinese automotive chip supplier SemiDrive announced on November 28 that it has raised nearly 1 billion yuan ($139 million) in its B+ financing round.
Nov. 28 , 2022
- Black Sesame Technologies partners with smart mobility solution developer Fusionride
Black Sesame Technologies, Chinese processor supplier, inked a strategic cooperation agreement with Fusionride, a local smart mobility solution provider, at the latter’s FUSIONRIDE DAY 2022 product ...
Nov. 28 , 2022
- Giantec Semiconductor’s proprietary NOR Flash storage chip passes AEC-Q100 validation
Chinese semiconductor supplier Giantec Semiconductor announced on November 22 that its self-developed NOR Flash storage chip has been officially validated by a third-party institution for AEC-Q100 Gra...
Nov. 22 , 2022
- Black Sesame Technologies joins hands with ZTE for intelligent vehicle development
Autonomous driving computing processor developer Black Sesame Technologies announced the cooperation with communication solution provider ZTE in the field of intelligent driving.
Nov. 18 , 2022
- SemiDrive teams up with INCHTEK for automotive information security products
China’s auto-grade chip supplier SemiDrive announced on November 10 the strategic cooperation with local intelligent vehicle information security developer, INCHTEK, onintelligent connected vehicle ...
Nov. 11 , 2022
- SemiDrive kicks off delivery of E3 high-performance MCU
Chinese automotive processor developer, SemiDrive, officially delivered to clients the first batch of its high-performance MCU, the E3,, marking a milestone for the company’s MCU mass production.
Oct. 28 , 2022
- Great Wall Motor to set up new semiconductor company
Great Wall Motor announced on October 22 its plan to incorporate a semiconductor joint venture which will involve a registered capital of 50 million yuan ($689.4 million).
Oct. 24 , 2022
